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通过与AgSbTe合金化协同抑制双极效应和晶格热导率,从而在BiSbTe材料中实现高平均优值。

Synergistic Suppression of Bipolar Effect and Lattice Thermal Conductivity Leading to High Average Figure of Merit in BiSbTe Materials through Alloying with AgSbTe.

作者信息

Qu Xiang, Chen Xiangbin, Yu Tian, Qi Ning, Chen Zhiquan

机构信息

Hubei Nuclear Solid Physics Key Laboratory, Department of Physics, Wuhan University, Wuhan 430072, China.

出版信息

ACS Appl Mater Interfaces. 2024 Nov 13;16(45):62347-62357. doi: 10.1021/acsami.4c12307. Epub 2024 Nov 3.

DOI:10.1021/acsami.4c12307
PMID:39492460
Abstract

Bismuth telluride-based materials have been widely used in commercial thermoelectric applications due to their excellent thermoelectric performance in the near-room-temperature range, yet further improvement of their thermoelectric properties is still necessary. Moreover, the narrow band gap of these materials results in a bipolar effect at elevated temperatures, which causes severe degradation of the thermoelectric performance. In this work, the commercial BiSbTe was alloyed with AgSbTe by using high-energy ball milling method combined with spark plasma sintering. It was found that ball milling can effectively reduce the lattice thermal conductivity of the samples. The alloying of AgSbTe leads to a gradual increase in hole carrier concentration, resulting in an enhanced electrical conductivity and optimized power factor. Additionally, the bipolar effect is also weakened due to the increased hole carrier concentration. Furthermore, the substitution of Ag in the Bi/Sb sublattice causes further reduction in the lattice thermal conductivity. Ultimately, the sample alloyed with 0.15 wt % AgSbTe demonstrates its best thermoelectric performance with a maximum of 1.35 at 393 K, showing a 20.5% improvement compared to the commercial sample. Besides, its average reaches a high value of 1.25 between 303 and 483 K, with a 27.6% improvement compared to that of the commercial sample.

摘要

碲化铋基材料因其在近室温范围内优异的热电性能而被广泛应用于商业热电应用中,但仍有必要进一步提高其热电性能。此外,这些材料的窄带隙导致在高温下产生双极效应,这会导致热电性能严重下降。在这项工作中,通过高能球磨法结合放电等离子烧结将商用BiSbTe与AgSbTe合金化。发现球磨可以有效降低样品的晶格热导率。AgSbTe的合金化导致空穴载流子浓度逐渐增加,从而提高了电导率并优化了功率因数。此外,由于空穴载流子浓度增加,双极效应也得到减弱。此外,Ag在Bi/Sb亚晶格中的取代导致晶格热导率进一步降低。最终,与0.15 wt% AgSbTe合金化的样品在393 K时表现出最佳热电性能,最大值为1.35,与商用样品相比提高了20.5%。此外,其在303至483 K之间的平均值达到1.25的高值,与商用样品相比提高了27.6%。

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