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用功能化石墨炔对铜纳米线表面进行电子扰动以增强一氧化碳还原反应

Electronic perturbation of Cu nanowire surfaces with functionalized graphdiyne for enhanced CO reduction reaction.

作者信息

Zou Haiyuan, Cheng Dongfang, Tang Chao, Luo Wen, Xiong Huatian, Dong Hongliang, Li Fan, Song Tao, Shu Siyan, Dai Hao, Cui Ziang, Lu Zhouguang, Duan Lele

机构信息

Department of Chemistry, Southern University of Science and Technology, Shenzhen 518055, China.

Department of Chemical and Biomolecular Engineering, University of California Los Angeles, Los Angeles 90095, USA.

出版信息

Natl Sci Rev. 2024 Jul 25;11(12):nwae253. doi: 10.1093/nsr/nwae253. eCollection 2024 Dec.

Abstract

Electronic perturbation of the surfaces of Cu catalysts is crucial for optimizing electrochemical CO reduction activity, yet still poses great challenges. Herein, nanostructured Cu nanowires (NW) with fine-tuned surface electronic structure are achieved via surface encapsulation with electron-withdrawing (-F) and -donating (-Me) group-functionalized graphdiynes (R-GDY, R = -F and -Me) and the resulting catalysts, denoted as R-GDY/Cu NW, display distinct CO reduction performances. electrochemical spectroscopy revealed that the *CO (a key intermediate of the CO reduction reaction) binding affinity and consequent *CO coverage positively correlate with the Cu surface oxidation state, leading to favorable C-C coupling on F-GDY/Cu NW over Me-GDY/Cu NW. Electrochemical measurements corroborate the favorable CH production with an optimum C selectivity of 73.15% ± 2.5% observed for F-GDY/Cu NW, while the predominant CH production is favored by Me-GDY/Cu NW. Furthermore, by leveraging the *Cu-hydroxyl (OH)/*CO ratio as a descriptor, mechanistic investigation reveals that the protonation of distinct adsorbed *CO facilitated by *Cu-OH is crucial for the selective generation of CH and CH on F-GDY/Cu NW and Me-GDY/Cu NW, respectively.

摘要

铜催化剂表面的电子扰动对于优化电化学CO还原活性至关重要,但仍面临巨大挑战。在此,通过用吸电子(-F)和给电子(-Me)基团功能化的石墨炔(R-GDY,R = -F和-Me)进行表面封装,实现了具有精细调节表面电子结构的纳米结构铜纳米线(NW),所得催化剂表示为R-GDY/Cu NW,表现出不同的CO还原性能。电化学光谱表明,CO(CO还原反应的关键中间体)的结合亲和力以及随之而来的CO覆盖率与铜表面氧化态呈正相关,导致F-GDY/Cu NW上的C-C偶联优于Me-GDY/Cu NW。电化学测量证实了F-GDY/Cu NW具有良好的CH生成,最佳C选择性为73.15%±2.5%,而Me-GDY/Cu NW则有利于主要生成CH。此外,通过利用Cu-羟基(OH)/CO比率作为描述符,机理研究表明,由Cu-OH促进的不同吸附CO的质子化分别对于F-GDY/Cu NW和Me-GDY/Cu NW上CH和CH的选择性生成至关重要。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/46fa/11562832/6726fdeab2fc/nwae253fig1.jpg

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