Bai Yutong, Liu Ziting, Niu Tianmu, Yi Yaozhen, Dou Haixu, Song Lingjie, Ren Luquan, Zhao Jie
Key Laboratory of Bionic Engineering, Ministry of Education, Jilin University, Changchun, 130012, China.
School of Materials Science and Engineering, Peking University, Beijing, 100871, China.
Small. 2025 Feb;21(6):e2411125. doi: 10.1002/smll.202411125. Epub 2024 Dec 24.
Traditional microneedle (MN) technology offers unique advantages in treating wound infections; however, its single-function design lacks the capability for real-time monitoring of wound conditions, often resulting in uncontrolled drug release. Herein, an anti-infective and intelligent MN patch (SP-CSMN) integrating three functional modules is developed, including temperature monitoring, Bluetooth wireless communication, and responsive drug release. The patch employed chitosan (CS) as a porous substrate, filled with temperature-sensitive poly(N-isopropylacrylamide) (PNIPAM) to encapsulate and release the antibiotic rifampicin. With the integrated sensing chip, SP-CSMN enabled continuous temperature monitoring and real-time feedback via smartphone Bluetooth communication. When the wound temperature exceeds 36.5 °C for 6 h, the system can automatically identify the infection occurrence and activate the heating module to trigger PNIPAM contraction, triggering rifampicin release. This self-sensing and intelligent release cycles can repeat throughout its life-cycle. The SP-CSMN demonstrated precisely temperature-induced drug release and enhanced antibacterial activities against Staphylococcus aureus (S. aureus) and Escherichia coli (E. coli) in vitro. Furthermore, it sensitively monitored wound temperature changes in infected mice and significantly accelerated wound healing via controlled drug delivery. This advanced MN system offers a promising solution for efficient management of bacterial wound infections.
传统微针（MN）技术在治疗伤口感染方面具有独特优势；然而，其单一功能设计缺乏对伤口状况进行实时监测的能力，常常导致药物释放不受控制。在此，开发了一种集成温度监测、蓝牙无线通信和响应性药物释放三个功能模块的抗感染智能微针贴片（SP-CSMN）。该贴片采用壳聚糖（CS）作为多孔基质，填充温度敏感的聚（N-异丙基丙烯酰胺）（PNIPAM）以包封和释放抗生素利福平。借助集成传感芯片，SP-CSMN能够通过智能手机蓝牙通信实现连续温度监测和实时反馈。当伤口温度超过36.5°C达6小时时，该系统能够自动识别感染发生并启动加热模块触发PNIPAM收缩，从而触发利福平释放。这种自感应和智能释放循环在其整个生命周期内均可重复。SP-CSMN在体外表现出精确的温度诱导药物释放，并增强了对金黄色葡萄球菌（S. aureus）和大肠杆菌（E. coli）的抗菌活性。此外，它能够灵敏地监测感染小鼠伤口的温度变化，并通过可控药物递送显著加速伤口愈合。这种先进的微针系统为细菌伤口感染的有效管理提供了一种有前景的解决方案。
