Akyle Ghalia, Achour Hassan
Department of Aesthetic Dentistry, Damascus University, Damascus, SYR.
Department of Endodontic and Operative Dentistry, Damascus University, Damascus, SYR.
Cureus. 2024 Nov 26;16(11):e74479. doi: 10.7759/cureus.74479. eCollection 2024 Nov.
Objectives This study aimed to compare the shear bond strength of three resin cements (light-cured resin cement, pre-heated composite resin, and dual-cured self-adhesive resin cement) when bonding to lithium disilicate discs. Materials and methods Thirty-six discs made of lithium disilicate were fabricated and etched with 9.5% (HF), and 36 human premolars were collected and immersed in the acrylic molds, then randomly divided into three equal groups (n = 12): Group 1: light-cured resin cement, Group 2: pre-heated resin composite, and Group 3: dual-cured resin cement. The resin composite was heated between 55°C and 65°C by a heater device. The shear bond strength test was performed using the general mechanical testing device. The data were analyzed using two-way ANOVA and Bonferroni tests (p < 0.05). Results The highest shear bond strength was demonstrated by the light-cured resin cement group (26.61 ± 5.16 Mpa), followed by the dual-cured resin cement group (17.76 ± 4.67 Mpa), and the least by the pre-heated composite resin group (15.58 ± 3.36 MPa). The shear bond strength in the light-cured resin cement group was significantly higher than the dual-cured resin cement and pre-heated composite resin groups. Conclusion The light-cured resin cement has higher shear bond strength when compared to pre-heated resin composite and dual-cured resin cement with a self-etch system. Although pre-heating composite resins may increase its mechanical proprieties and make it suitable for luting ceramics it may not increase bond strength.
目的 本研究旨在比较三种树脂水门汀(光固化树脂水门汀、预热复合树脂和双重固化自粘树脂水门汀)与二硅酸锂盘片粘结时的剪切粘结强度。
材料与方法 制作36个二硅酸锂盘片,用9.5%(氢氟酸)蚀刻,收集36颗人类前磨牙并浸入丙烯酸模具中,然后随机分为三组,每组12个:第1组:光固化树脂水门汀;第2组:预热复合树脂;第3组:双重固化树脂水门汀。用加热装置将复合树脂在55℃至65℃之间加热。使用通用机械测试装置进行剪切粘结强度测试。采用双向方差分析和Bonferroni检验对数据进行分析(p < 0.05)。
结果 光固化树脂水门汀组的剪切粘结强度最高(26.61±5.16兆帕),其次是双重固化树脂水门汀组(17.76±4.67兆帕),预热复合树脂组最低(15.58±3.36兆帕)。光固化树脂水门汀组的剪切粘结强度显著高于双重固化树脂水门汀组和预热复合树脂组。
结论 与预热复合树脂和具有自酸蚀系统的双重固化树脂水门汀相比,光固化树脂水门汀具有更高的剪切粘结强度。尽管预热复合树脂可能会提高其机械性能并使其适合用于粘结陶瓷,但可能不会提高粘结强度。