Noghanian Sima, Chang Yi-Hsiang, Guerron Patricio, Dahle Reena
CommScope Ruckus Networks, Sunnyvale, CA 94089, USA.
Department of Technology, Illinois State University, Normal, IL 61761, USA.
Micromachines (Basel). 2024 Nov 29;15(12):1449. doi: 10.3390/mi15121449.
This paper presents a novel foldable S-band microstrip patch antenna array operating in the 2.4-2.45 GHz band. The substrate is designed to allow the array to be folded and arranged in tiles, forming a versatile, reconfigurable antenna array. Additive manufacturing is used to fabricate the substrate for ease of fabrication and flexibility in its design. The major challenge in this type of design is creating a proper method of feeding the elements while maintaining the array's optimal performance. A novel hinge design that can hold a coaxial cable for the series-fed array is introduced. The hinge provides the capability of folding the array from a flat orientation into various folded orientations. In this paper, a 2 × 1 microstrip array unit is presented as proof of concept. The antenna was fabricated and measured, and the results of the measurements are in close agreement with the simulations. The antenna can provide a gain as high as 7.72 dBi in flat conditions.
本文介绍了一种工作在2.4 - 2.45 GHz频段的新型可折叠S波段微带贴片天线阵列。该基板的设计允许阵列进行折叠并排列成瓦片状,从而形成一个多功能、可重构的天线阵列。采用增材制造来制造基板,以便于制造并在设计上具有灵活性。这类设计中的主要挑战是在保持阵列最佳性能的同时,创建一种合适的元件馈电方法。本文介绍了一种新颖的铰链设计,该设计可为串联馈电阵列固定同轴电缆。该铰链具备将阵列从平面方向折叠成各种折叠方向的能力。在本文中,展示了一个2×1微带阵列单元作为概念验证。制作并测量了该天线,测量结果与仿真结果非常吻合。在平面状态下,该天线可提供高达7.72 dBi的增益。