Lee Junyeob, Kim Kyongnam
Department of Energy & Advanced Materials Engineering, Daejeon University, Daejeon 34520, Republic of Korea.
Sensors (Basel). 2024 Dec 24;25(1):20. doi: 10.3390/s25010020.
Plasma processes are critical for achieving precise device fabrication in semiconductor manufacturing. However, polymer accumulation during processes like plasma etching can cause chamber contamination, adversely affecting plasma characteristics and process stability. This study focused on developing a real-time sensor system for diagnosing chamber contamination by quantitatively monitoring polymer accumulation. A quartz crystal sensor integrated with flexible printed circuit boards was designed to measure the frequency shifts corresponding to polymer thickness changes. An impedance probe was also employed to monitor variations in the plasma discharge characteristics. The sensor demonstrated high reliability with a measurement scatter of 2.5% despite repeated plasma exposure. The experimental results revealed that polymer accumulation significantly influenced the plasma impedance, and this correlation was validated through real-time monitoring and scanning electron microscopy (SEM). The study further showed that the sensor could detect the transition point of the plasma state changes under varying process gas conditions, enabling the early detection of potential process anomalies. These findings suggest that the developed sensor system can be crucial for diagnosing plasma and chamber conditions, providing valuable data for optimizing preventive maintenance schedules. This advancement offers a pathway for improving process reliability and extending the operational lifetime of semiconductor manufacturing equipment.
等离子体工艺对于在半导体制造中实现精确的器件制造至关重要。然而,在等离子体蚀刻等工艺过程中聚合物的积累会导致腔室污染,对等离子体特性和工艺稳定性产生不利影响。本研究专注于开发一种实时传感器系统,通过定量监测聚合物积累来诊断腔室污染。设计了一种与柔性印刷电路板集成的石英晶体传感器,用于测量与聚合物厚度变化相对应的频率偏移。还采用了阻抗探头来监测等离子体放电特性的变化。尽管多次进行等离子体暴露,该传感器仍表现出高可靠性,测量分散度为2.5%。实验结果表明,聚合物积累对等离子体阻抗有显著影响,并且通过实时监测和扫描电子显微镜(SEM)验证了这种相关性。该研究进一步表明,该传感器能够在不同工艺气体条件下检测等离子体状态变化的转变点,从而能够早期检测潜在的工艺异常。这些发现表明,所开发的传感器系统对于诊断等离子体和腔室状况可能至关重要,为优化预防性维护计划提供有价值的数据。这一进展为提高工艺可靠性和延长半导体制造设备的使用寿命提供了一条途径。