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基于成分调控的Cu-Fe-Mg-Ti合金微观结构与性能研究

A Study on the Microstructure and Properties of Cu-Fe-Mg-Ti Alloys Based on Composition Regulation.

作者信息

Ding Yu, Xiao Xiangpeng, Yuan Dawei, Chen Jinshui

机构信息

Advanced Copper Industry College, Jiangxi University of Science and Technology, Ganzhou 341000, China.

Faculty of Materials Metallurgy and Chemistry, Jiangxi University of Science and Technology, Yingtan 335000, China.

出版信息

Materials (Basel). 2025 Mar 17;18(6):1325. doi: 10.3390/ma18061325.

Abstract

This study systematically investigates how Fe-Ti atomic ratios (1:1, 1:2, and 2:1) influence the microstructure, mechanical properties, and softening resistance of Cu-Fe-Mg-Ti alloys under fixed total Fe + Ti content. Through hardness testing, electrical conductivity measurements, and multiscale characterization (optical microscopy, scanning/transmission electron microscopy, and X-ray diffraction), we reveal a previously unreported phenomenon: Ti-dominated ratios (1:2) enable superior strength-conductivity synergy. After 70% cold rolling and 550 °C aging, the alloy with a 2:1 Fe/Ti ratio exhibits peak hardness (166.5 HV) and conductivity (64.1% IACS), outperforming both 1:1 (173.9 HV, 51.3% IACS) and 1:2 (189.5 HV, 44.2% IACS) counterparts. Critical microstructure analysis confirms that increased Ti content promotes high-density FeTi nanoprecipitation (5-15 nm) with coherent interfaces, enhancing strength while mitigating electron scattering. This work establishes atomic ratio optimization as a novel strategy to break the traditional strength-conductivity trade-off in copper alloys, providing a 21% hardness improvement over conventional Fe-Ti systems without sacrificing essential electrical performance.

摘要

本研究系统地研究了在固定的总铁+钛含量下,铁钛原子比(1:1、1:2和2:1)如何影响铜铁镁钛合金的微观结构、力学性能和抗软化性能。通过硬度测试、电导率测量和多尺度表征(光学显微镜、扫描/透射电子显微镜和X射线衍射),我们揭示了一个此前未报道的现象:钛占主导的比例(1:2)能实现卓越的强度-电导率协同效应。在70%冷轧和550℃时效后,铁/钛比为2:1的合金表现出峰值硬度(166.5 HV)和电导率(64.1% IACS),优于铁/钛比为1:1(173.9 HV,51.3% IACS)和1:2(189.5 HV,44.2% IACS)的合金。关键微观结构分析证实,增加钛含量会促进具有共格界面的高密度FeTi纳米析出物(5-15纳米)的形成,在增强强度的同时减轻电子散射。这项工作将原子比优化确立为一种打破铜合金传统强度-电导率权衡的新策略,在不牺牲基本电学性能的情况下,相较于传统铁钛体系,硬度提高了21%。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5972/11944126/aad102e5a028/materials-18-01325-g001.jpg

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