Que Meidan, Wang Bin, Yang Yawei
College of Materials Science and Engineering, Xi'an University of Architecture and Technology, Xi'an, 710055, P. R. China.
Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education, International Center for Dielectric Research, Shaanxi Engineering Research Center of Advanced Energy Materials and Devices, School of Electronic Science and Engineering, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
Small. 2025 May;21(21):e2411628. doi: 10.1002/smll.202411628. Epub 2025 Apr 10.
Benefiting from the optimal interaction strength between Cu and reactants, Cu-based catalysts exhibit a unique capability of facilitating the formation of various multi-carbon products in electricity-driven CO reduction reactions (COERR). Nonetheless, the COERR process on these catalysts is characterized by intricate polyproton-electron transfer mechanisms that are frequently hindered by high energy barriers, sluggish reaction kinetics, and low C─C coupling efficiency. This review employs advanced characterization techniques, such as sum frequency generation technology, to provide a comprehensive analysis of the COERR mechanism on the Cu surface, examining it from both spatial and temporal dimensions and proposing a spatial-temporal coupling reaction mechanism. To improve C─C coupling efficiency, a series of regulatory strategies are focused on surface microenvironment, catalyst surface structure, and internal electronic structure, thereby offering novel insights for the upcoming design and enhancement of Cu-based electrocatalysts.
得益于铜与反应物之间的最佳相互作用强度,铜基催化剂在电驱动的一氧化碳还原反应(COERR)中展现出促进各种多碳产物形成的独特能力。尽管如此,这些催化剂上的COERR过程具有复杂的多质子-电子转移机制,这些机制经常受到高能垒、缓慢的反应动力学和低C─C耦合效率的阻碍。本综述采用先进的表征技术,如和频产生技术,对铜表面的COERR机制进行全面分析,从空间和时间维度对其进行研究,并提出一种时空耦合反应机制。为了提高C─C耦合效率,一系列调控策略聚焦于表面微环境、催化剂表面结构和内部电子结构,从而为未来铜基电催化剂的设计和改进提供新的见解。