Yan Yong, Zhou Huan, Li Tongxian, Wang Dong, Schaaf Peter, Guo Guangsheng, Wang Xiayan
State Key Laboratory of Materials Low-Carbon Recycling, Center of Excellence for Environmental Safety and Biological Effects, Department of Chemistry, College of Chemistry and Life Science, Beijing University of Technology, Beijing, 100124, China.
Chair Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering and Institute of Micro- and Nanotechnologies MarcoNano, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693, Ilmenau, Germany.
Small. 2025 Apr 21:e2501125. doi: 10.1002/smll.202501125.
The development of effective strategies to enhance the activity and selectivity of Cu-based catalysts for the CO reduction reaction (CORR) remains a critical challenge, particularly on relatively inert Cu facets that are highly active in the competitive hydrogen evolution reaction (HER). In this study, a series of Cu-M (M = Au, Ag, Pd) bimetallic tandem interfaces are fabricated on Cu nanocolumn arrays (Cu NCAs) with predominantly exposed Cu (200) facets. These interfaces excited a significant number of Cu species and modulated the adsorption behavior of critical intermediates for CORR, resulting in improved CORR activity and a substantial reduction in the competitive HER. Notably, the Cu-Au, Cu-Ag, and Cu-Pd NCAs displayed excellent selectivity for CH, CO, and HCOOH products, with optimized faradaic efficiency (FE) of ≈43.2, ≈48.0, and ≈50.7%, respectively. According to in situ spectroscopic analysis, each Cu-M interface exhibited distinct catalytic pathways: Cu-Au favored *COOH and *CO adsorption followed by C-C coupling for CH production, Cu-Ag promoted *CO desorption for CO generation, and Cu-Pd facilitated *OCHO formation for HCOOH production. This study provides a strategy to design high-performance and more practical bimetallic Cu-based catalytic electrodes by directly modifying various commercial Cu substrates.
开发有效的策略以提高铜基催化剂对一氧化碳还原反应(CORR)的活性和选择性仍然是一项严峻的挑战,尤其是在对竞争性析氢反应(HER)具有高活性的相对惰性的铜晶面上。在本研究中,一系列Cu-M(M = Au、Ag、Pd)双金属串联界面被制备在主要暴露Cu(200)晶面的铜纳米柱阵列(Cu NCAs)上。这些界面激发了大量的铜物种,并调节了CORR关键中间体的吸附行为,从而提高了CORR活性,并大幅降低了竞争性HER。值得注意的是,Cu-Au、Cu-Ag和Cu-Pd NCAs对CH、CO和HCOOH产物表现出优异的选择性,优化后的法拉第效率(FE)分别约为43.2%、48.0%和50.7%。根据原位光谱分析,每个Cu-M界面都表现出不同的催化途径:Cu-Au有利于COOH和CO吸附,随后进行C-C偶联以生成CH;Cu-Ag促进CO解吸以生成CO;Cu-Pd促进OCHO形成以生成HCOOH。本研究提供了一种通过直接修饰各种商用铜基底来设计高性能且更实用的双金属铜基催化电极的策略。