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共聚焦激光扫描显微镜对用复合树脂替代的汞合金修复体中粘结剂的评估

CSLM evaluation of bonding agents in amalgam restoration replaced with composite resin.

作者信息

Ghosh Sayanti, Shenoi Pratima, Uke Manjeet, Niswade Ankita

机构信息

Department of Conservative Dentistry and Endodontics, Guru Nanak Institute of Dental Sciences and Research, Kolkata, West Bengal, India.

Ranjeet Deshmukh Dental College and Research Centre, Nagpur, Maharashtra, India.

出版信息

J Conserv Dent Endod. 2025 May;28(5):474-480. doi: 10.4103/JCDE.JCDE_165_25. Epub 2025 May 6.

Abstract

AIM

This study aims to analyze the depth of penetration of two different adhesives using Confocal Laser Scanning Microscope in Class I amalgam restorations replaced with composite restorations.

SUBJECTS AND METHODS

Eighty freshly extracted human premolars were selected for the study. Samples were randomly divided into four groups ( = 20). Class I cavities were prepared for composite resin restorations the adhesive used in Group Ia: Tetric N-Bond and Group Ib: Tetric N-Bond Universal. For Group II and Group III: Samples were first restored with silver amalgam and removed after 1 year followed by composite resin restoration: Adhesive used in Group II: Tetric N-Bond and Group III: Tetric N-Bond Universal. While using the adhesives each time, they were labeled with 0.1% Rhodamine B dye. After restoring the samples using Te-Econom Plus, they were sectioned with a microtome precision saw. CLSM was used to determine the thickness of the hybrid layer and the number of resin tags.

RESULTS

Higher values of thickness of hybrid layer and number of resin tags were observed in the control group as compared to the experimental groups.

CONCLUSIONS

A significantly thicker hybrid layer and higher number of resin tags were obtained when a total-etch system was used for replacing old amalgam restoration with composite resin.

摘要

目的

本研究旨在使用共聚焦激光扫描显微镜分析在I类银汞合金修复体替换为复合树脂修复体时两种不同黏结剂的渗透深度。

对象与方法

选取80颗新鲜拔除的人类前磨牙用于本研究。样本随机分为四组(每组n = 20)。为复合树脂修复制备I类洞,Ia组使用的黏结剂为:Tetric N-Bond,Ib组为:Tetric N-Bond Universal。II组和III组:样本先使用银汞合金修复,1年后去除,随后进行复合树脂修复:II组使用的黏结剂为:Tetric N-Bond,III组为:Tetric N-Bond Universal。每次使用黏结剂时,用0.1%罗丹明B染料进行标记。使用Te-Econom Plus修复样本后,用切片机精密锯进行切片。使用共聚焦激光扫描显微镜确定混合层的厚度和树脂突的数量。

结果

与实验组相比,对照组的混合层厚度和树脂突数量的值更高。

结论

当使用全酸蚀系统用复合树脂替换旧的银汞合金修复体时,可获得显著更厚的混合层和更多的树脂突。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a777/12129292/e68fe3028d9f/JCDE-28-474-g001.jpg

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