Gou Genchang, Li Zexin, Xu Xiang, Wang Haoyun, Gu Honggang, Gao Liang, Zhai Tianyou, Zhou Xing
State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China.
State Key Laboratory of Intelligent Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China.
Small. 2025 Jul 11:e2504001. doi: 10.1002/smll.202504001.
Broadband in-sensor computing (BISC) technology integrates high-dimensional visual perception and processing, significantly reducing inter-unit data exchange while enhancing system efficiency and response speed. This capability is particularly crucial in addressing the exponential growth of broadband visual sensing data driven by the rapid advancement of machine vision. 2D materials, with strong light-matter interactions, broadband absorption, tunable electronic structures, and exceptional integration compatibility, offer a compelling platform for monolithic BISC implementation. This review systematically explores recent progress in broadband visual information perception and processing based on 2D materials. It begins by categorizing the broadband photodetection potential of various 2D materials, followed by an in-depth discussion of their integration into photodetectors, focusing on intrinsic 2D materials, localized field enhancement, and heterostructures. The latest advancements in BISC are then highlighted, emphasizing emerging strategies for high-dimensional visual information processing. Finally, key challenges and future directions are discussed, aiming to guide the development of 2D materials toward integrated high-dimensional sensing and intelligent computing.
宽带片上传感器计算(BISC)技术集成了高维视觉感知与处理功能,在显著减少单元间数据交换的同时,提高了系统效率和响应速度。这种能力对于应对机器视觉快速发展所驱动的宽带视觉传感数据呈指数级增长的情况尤为关键。二维材料具有强光与物质相互作用、宽带吸收、可调控电子结构以及出色的集成兼容性等特性,为单片BISC实现提供了极具吸引力的平台。本综述系统地探讨了基于二维材料的宽带视觉信息感知与处理的最新进展。首先对各种二维材料的宽带光电探测潜力进行分类,随后深入讨论它们在光电探测器中的集成,重点关注本征二维材料、局域场增强和异质结构。接着突出了BISC的最新进展,强调了高维视觉信息处理的新兴策略。最后讨论了关键挑战和未来方向,旨在引导二维材料朝着集成高维传感与智能计算的方向发展。