Garg Meghali, Bhullar Mandeep K, Ahuja Gaurav, Parveen Abida, Mittal Naman, Kapoor Stela
Department of Orthodontics and Dentofacial Orthopedics, Maharishi Markandeshwar College of Dental Sciences and Research, Ambala, IND.
Cureus. 2025 Jun 20;17(6):e86439. doi: 10.7759/cureus.86439. eCollection 2025 Jun.
This in vitro study aims to compare the shear bond strength (SBS) and Adhesive Remnant Index (ARI) values of various eighth-generation adhesives used in orthodontic bonding.
A total of 40 extracted human premolars were randomly divided into four groups; (i) Group 1: 3M Unitek Transbond-XT (fifth-generation adhesive, conventional etch, 3M Electro & Communication India Private Limited, Bengaluru, India) (ii) Group 2: 3M ESPE Single Bond Universal (eighth-generation, 3M Electro & Communication India Private Limited, Bengaluru, India), (iii) Group 3: Tetric-N-Bond Universal (eighth-generation, Ivoclar Vivadent, Schaan, Liechtenstein), and (iv) Group 4: G-Premio Bond (eighth-generation, GC Corporation, London, UK). The premolars, stored in saline water, were bonded with stainless steel brackets using respective bonding agents and 3M Unitek Transbond-XT composite. The SBS values were tested using an Instron universal testing machine (Asian Test Equipments, Ghaziabad, India). Post-debonding, ARI scores for each group were evaluated using a stereomicroscope at 10X magnification.
The SBS values for the adhesives were 3M ESPE Single Bond Universal (2.29 ± 1.12 MPa), Tetric-N-Bond Universal (5.26 ± 2.6 MPa), G-Premio Bond (5.07 ± 1.72 MPa), and 3M Unitek Transbond-XT (10.22 ± 4.83 MPa). ARI scores differed across groups, with most samples showing a score of 2 and only the 3M Unitek Transbond-XT group recording an ARI score of 3. The Chi-square value was 19.42 (p = 0.02), indicating a moderately significant difference.
This study concluded that while eighth-generation adhesives like Tetric-N-Bond Universal and G-Premio Bond offer advantages in enamel protection and cleanup due to lower ARI scores, their SBS was lower than that of 3M Unitek Transbond-XT, which performed significantly better.
本体外研究旨在比较正畸粘接中使用的各种第八代粘接剂的剪切粘接强度（SBS）和粘接剂残留指数（ARI）值。
总共40颗拔除的人类前磨牙被随机分为四组；（i）第1组：3M Unitek Transbond-XT（第五代粘接剂，传统酸蚀，3M印度电子与通信私人有限公司，班加罗尔，印度）（ii）第2组：3M ESPE单组分通用粘接剂（第八代，3M印度电子与通信私人有限公司，班加罗尔，印度），（iii）第3组：Tetric-N-Bond通用粘接剂（第八代，义获嘉伟瓦登特公司，沙恩，列支敦士登），以及（iv）第4组：G-Premio Bond（第八代，GC公司，伦敦，英国）。将保存在盐水中的前磨牙使用各自对应的粘接剂和3M Unitek Transbond-XT复合树脂与不锈钢托槽进行粘接。使用Instron万能材料试验机（亚洲测试设备公司，加济阿巴德，印度）测试SBS值。脱粘后，使用放大10倍的体视显微镜评估每组的ARI评分。
各粘接剂的SBS值分别为：3M ESPE单组分通用粘接剂（2.29±1.12MPa）、Tetric-N-Bond通用粘接剂（5.26±2.6MPa）、G-Premio Bond（5.07±1.72MPa）和3M Unitek Transbond-XT（10.22±4.83MPa）。各组的ARI评分有所不同，大多数样本评分为2分，只有3M Unitek Transbond-XT组的ARI评分为3分。卡方值为19.42（p = 0.02），表明存在中度显著差异。
本研究得出结论，虽然像Tetric-N-Bond通用粘接剂和G-Premio Bond这样的第八代粘接剂由于较低的ARI评分在牙釉质保护和清理方面具有优势，但其SBS低于3M Unitek Transbond-XT，后者的性能明显更好。
