A Crystal Plasticity Phase-Field Study on the Effects of Grain Boundary Degradation on the Fatigue Behavior of a Nickel-Based Superalloy.

Grain boundary weakening in high-temperature environments significantly influences the fatigue crack growth mechanisms of nickel-based superalloys, introducing challenges in accurately predicting fatigue life. In this study, a dislocation-density-based crystal plasticity phase-field (CP-PF) model is developed to simulate the fatigue crack growth behavior of the GH4169 alloy under both room and elevated temperatures. Grain boundaries are explicitly modeled, enabling the competition between transgranular and intergranular cracking to be accurately captured. The grain boundary separation energy and surface energy, calculated via molecular dynamics simulations, are employed as failure criteria for grain boundary and intragranular material points, respectively. The simulation results reveal that under oxygen-free conditions, fatigue crack propagation at both room and high temperatures is governed by sustained shear slip, with crack advancement hindered by grains exhibiting low Schmid factors. When grain boundary oxidation is introduced, increasing oxidation levels progressively degrade grain boundary strength and reduce overall fatigue resistance. Specifically, at room temperature, oxidation shortens the duration of crack arrest near grain boundaries. At elevated service temperatures, intensified grain boundary degradation facilitates a transition in crack growth mode from transgranular to intergranular, thereby accelerating crack propagation and exacerbating fatigue damage.