Yang Xiaoyu, Cao Yang, Zhang Rong, Li Xing, He Jiajun, Li Shuai, Li Haisu, Xu Quan, Lang Liying
Opt Express. 2025 Feb 10;33(3):4778-4789. doi: 10.1364/OE.547331.
The emerging planar photonic crystal (PC) and effective medium (EM) waveguides are considered promising technical platforms for terahertz communications. Beyond short-scale connections and various signal processing functionalities, versatile terahertz on-chip systems could be achievable by their physical integration; however, the inefficient coupling poses challenges. In this work, we propose an interface design between planar PC and EM waveguides with minimal insertion loss. Stereolithography 3D printing was validated as a cost-effective alternative to the microfabrication technologies for the demonstration of these two waveguide designs. Experiments found that optimized PC and EM waveguides in photosensitive resin exhibited transmission losses of 3.4 dB/cm and 2.1 dB/cm at 140 GHz, respectively. Furthermore, by adjusting the radius and positioning of certain air holes adjacent to the waveguide core, we reduced the insertion loss associated with the waveguide interface to 0.4 dB; significantly lower compared with direct butt coupling without transitions. The ∼30% increase in power coupling efficiency enabled terahertz signal transmission with higher data rates and lower bit error rate for terahertz communications. We believe that the proposed terahertz planar waveguide fabrication routes and structural designs could hold huge potential to offer efficient rapid-prototyping and inter-waveguide integration solutions for multifunctional terahertz circuits.
新兴的平面光子晶体(PC)和有效介质(EM)波导被认为是太赫兹通信中很有前景的技术平台。除了短距离连接和各种信号处理功能外,通过它们的物理集成可以实现通用的太赫兹片上系统;然而,低效的耦合带来了挑战。在这项工作中,我们提出了一种平面PC和EM波导之间的接口设计,具有最小的插入损耗。立体光刻3D打印被验证为一种经济高效的替代微加工技术的方法,用于展示这两种波导设计。实验发现,在光敏树脂中优化的PC和EM波导在140 GHz时的传输损耗分别为3.4 dB/cm和2.1 dB/cm。此外,通过调整与波导芯相邻的某些气孔的半径和位置,我们将与波导接口相关的插入损耗降低到了0.4 dB;与没有过渡的直接对接耦合相比,显著更低。功率耦合效率提高约30%,使得太赫兹通信能够以更高的数据速率和更低的误码率进行太赫兹信号传输。我们相信,所提出的太赫兹平面波导制造路线和结构设计具有巨大潜力,可为多功能太赫兹电路提供高效的快速原型制作和波导间集成解决方案。