Weniger P, Wawra E, Dolejs I
Radiat Environ Biophys. 1979 Apr 30;16(2):135-41. doi: 10.1007/BF01323221.
The time-course of DNA repair after gamma irradiation was measured in HeLa cells at various temperatures. Unscheduled DNA synthesis was estimated by incorporation of 3H-thymidine in presence of hydroxyurea. To detect the ligase reaction, the number of single strand breaks (SSB) was determined by centrifugation in alcaline sucrose as well as by hydroxylapatite chromatography after partial denaturation. In addition, the temperature dependence of DNA polymerase and DNase reaction in cell-free systems were measured. These data were compared with the reduction of colony-forming ability of the cells caused by gamma irradiation and following repair at various temperatures. All steps of repair proceed faster at 41--43 degrees than at 37 degrees but cells are most resistant to gamma irradiation at 37 degrees. We therefore assume that the DNA repair process at 42 degrees is faster but more error prone than at 37 degrees.
在不同温度下测量了HeLa细胞经γ射线照射后DNA修复的时间进程。通过在羟基脲存在的情况下掺入³H-胸腺嘧啶来估计非预定DNA合成。为了检测连接酶反应,通过碱性蔗糖离心以及部分变性后的羟基磷灰石色谱法测定单链断裂(SSB)的数量。此外,还测量了无细胞体系中DNA聚合酶和DNA酶反应的温度依赖性。将这些数据与γ射线照射及在不同温度下修复后细胞集落形成能力的降低进行了比较。修复的所有步骤在41 - 43摄氏度下比在37摄氏度下进行得更快,但细胞在37摄氏度时对γ射线照射最具抗性。因此,我们假设42摄氏度时的DNA修复过程比37摄氏度时更快,但更容易出错。