Onagawa J, Abe T
Shika Rikogaku Zasshi. 1981 Apr;22(59):157-61.
In this paper, the experiments have been carried out to find the effects of additional copper and to find a correlation between the microstructure and the electrochemical behavior of dental amalgam. The corrosion behavior of high copper amalgam has been investigated by potentiostatic anodic polarization in 0.9% NaCl solution and compared with conventional dental amalgam. High copper amalgam become appreciably more noble (potential shift from -0.15 V to 0.5 approximately 0.8 V vs SCE). Such a behavior has been explained in terms of the solid state transformation which involves the elimination of the corrosion prone gamma 2 phase and the conversion of an electrochemically Cu6Sn5 intermetallic to a noble Cu3Sn.
在本文中，已开展实验以探究额外添加铜的影响，并找出牙科汞合金的微观结构与电化学行为之间的关联。通过在0.9%氯化钠溶液中进行恒电位阳极极化，研究了高铜汞合金的腐蚀行为，并与传统牙科汞合金进行了比较。高铜汞合金变得明显更正电（相对于饱和甘汞电极，电位从-0.15 V 转变为约0.5至0.8 V）。这种行为已根据固态转变进行了解释，该转变涉及消除易腐蚀的γ2相，并将电化学性质的Cu6Sn5金属间化合物转变为更惰性的Cu3Sn。
