Microscopic study of smooth silver-plated retention pins in amalgam.

A silver-plating technique was developed in an effort to produce good mechanical bonding characteristics between stainless steel pins and amalgam. Metallographic microscope and scanning electron microscope (SEM) studies were made to assess the presence, or otherwise, of such a bond between (a) the silver layer plating and the surface of the stainless steel pins, and (b) and silver plating and the amalgam. Unplated stainless steel and sterling silver pins were used as a control and as a comparison, respectively. A "rubbing" technique of condensation was devised closely adapt amalgam to the pins. It is concluded that there is strong evidence for the existence of a good bond between the plated pins and amalgam. The mechanical performance of the bond is discussed elsewhere.