Arnemann J, Sullivan K H, Magee A I, King I A, Buxton R S
Laboratory of Eukaryotic Molecular Genetics, National Institute for Medical Research, Mill Hill, London, United Kingdom.
J Cell Sci. 1993 Mar;104 ( Pt 3):741-50. doi: 10.1242/jcs.104.3.741.
Desmosomal junctions are abundant in epidermis and contain two classes of transmembrane glycoprotein, the desmocollins and the desmogleins, which are members of the cadherin superfamily of Ca(2+)-dependent cell adhesion molecules. The desmocollin subfamily includes DGIV/V and DGII/III while the desmoglein subfamily includes DGI, HDGC and the autoantigen of the blistering skin disease pemphigus vulgaris (PVA). There are also several non-glycosylated proteins, including the desmoplakins and plakoglobin, present in the desmosomal plaque, which forms a link between the glycoproteins and the cytokeratin intermediate filaments. To provide a picture of the expression of the desmosomal genes and their products in epidermis, we have used in situ hybridisation and immunofluorescence staining on sections of human foreskin. We find that, as expected, desmoplakin DPI/II and plakoglobin are expressed throughout the epidermis, gradually accumulating during differentiation, which probably reflects the increased numbers of desmosomes. In contrast, while keratin 14 and the hemidesmosomal component bullous pemphigoid antigen I (BPAGI) are basal-specific, desmocollin DGIV/V is expressed only in the upper spinous/granular layers of the epidermis, whereas DGII/III expression is enriched in the basal layers. Amongst the desmogleins, expression of DGI appears similar to desmoplakin and plakoglobin; PVA is more prevalent in the lower spinous layers, whereas HDGC expression is detected basally but not suprabasally. The major desmosomal cadherin transcripts are desmocollin DGIV/V and desmoglein DGI. The resultant changes in desmosomal composition and structure may reflect the maturation of desmosomes, presumably being related to the need for changes in cell adhesion during stratification, terminal differentiation, and desquamation, and point to the desmosome being a key player in epidermal differentiation.
桥粒连接在表皮中大量存在,包含两类跨膜糖蛋白,即桥粒芯蛋白和桥粒胶蛋白,它们是钙(2+)依赖性细胞黏附分子钙黏蛋白超家族的成员。桥粒芯蛋白亚家族包括DGIV/V和DGII/III,而桥粒胶蛋白亚家族包括DGI、HDGC以及寻常型天疱疮(PVA)的自身抗原。桥粒斑中还存在几种非糖基化蛋白,包括桥粒斑蛋白和桥粒珠蛋白,它们在糖蛋白和细胞角蛋白中间丝之间形成连接。为了描绘桥粒基因及其产物在表皮中的表达情况,我们对人包皮切片进行了原位杂交和免疫荧光染色。我们发现,正如预期的那样,桥粒斑蛋白DPI/II和桥粒珠蛋白在整个表皮中表达,在分化过程中逐渐积累,这可能反映了桥粒数量的增加。相比之下,角蛋白14和半桥粒成分大疱性类天疱疮抗原I(BPAGI)是基底特异性的,桥粒芯蛋白DGIV/V仅在表皮的上棘层/颗粒层表达,而DGII/III的表达在基底层富集。在桥粒胶蛋白中,DGI的表达与桥粒斑蛋白和桥粒珠蛋白相似;PVA在下棘层更为普遍,而HDGC的表达在基底检测到,但在基底上方未检测到。主要的桥粒钙黏蛋白转录本是桥粒芯蛋白DGIV/V和桥粒胶蛋白DGI。桥粒组成和结构的最终变化可能反映了桥粒的成熟,推测与分层、终末分化和脱屑过程中细胞黏附变化的需求有关,并表明桥粒是表皮分化的关键因素。