Link L F, Gerristead W R, Tamhankar S
BOC Group, Inc., Technical Center, Murray Hill, New Jersey 07974.
Microsc Res Tech. 1993 Aug;25(5-6):518-22. doi: 10.1002/jemt.1070250524.
The significance of the ElectroScan environmental scanning electron microscope (ESEM) as a processing tool for studying dynamic morphological changes under controlled temperature/atmosphere conditions was evaluated. The ability to observe dynamic processes in situ, which cannot be achieved by other means, is critical to understanding microstructural formation. Processing of printed copper thick films on ceramics was used as a test case, wherein morphological changes associated with the steps of organic binder removal and sintering of copper particles were observed/examined in real time. Good agreement was seen between microstructures obtained in the ESM and those achieved in a belt furnace when similar process variables were used. When processed in atmospheres which were proven to induce sintering in a conventional belt furnace, sintering was evident in both cases, and the microstructural changes were documented on video-tapes in real time. Determination of critical event temperatures was achieved--that is, binder burnout occurring between 270 degrees and 350 degrees C, onset of oxidation at 520 degrees C, and sintering starting at 770 degrees C. It was thus verified that the microstructural changes during the copper thick film sintering process can be observed in situ using an ESEM.
评估了电子扫描环境扫描电子显微镜（ESEM）作为一种在可控温度/气氛条件下研究动态形态变化的加工工具的重要性。能够原位观察动态过程，这是其他方法无法实现的，对于理解微观结构的形成至关重要。以在陶瓷上印刷铜厚膜的加工过程为例，实时观察/研究了与有机粘结剂去除和铜颗粒烧结步骤相关的形态变化。当使用相似的工艺变量时，在环境扫描显微镜中获得的微观结构与在带式炉中获得的微观结构之间具有良好的一致性。当在经证实能在传统带式炉中引发烧结的气氛中进行加工时，两种情况下烧结均很明显，并且微观结构变化被实时记录在录像带上。确定了关键事件温度，即粘结剂在270℃至350℃之间烧尽，在520℃开始氧化，在770℃开始烧结。因此证实了使用环境扫描电子显微镜可以原位观察铜厚膜烧结过程中的微观结构变化。
