Wang C C, Hsu C S
Department of Prosthodontics, School of Dentistry, Kaohsiung Medical College, Taiwan, Republic of China.
Kaohsiung J Med Sci. 1996 Jun;12(6):326-38.
The use of base metal alloys for porcelain fused to a metal crown and bridges has increased recently because of lower price, high hardness, high tensile strength and high elastic modulus. The addition of beryllium to base metal alloys increased fluidity and improved casting fitness. Beryllium also controlled surface oxidation and bonding strength. The bonding agent and gold bonding agent also affected the bonding strength between porcelain and metal alloys. Four commercially available ceramic base alloys were studied (two alloys contained beryllium element, another two did not). The purpose of this investigation was to study the microstructure between porcelain matrix, bonding agent and alloy matrix interfaces. A scanning electron micro-probe analyzer and energy dispersive X-ray spectroscopy (EDXS) were used to study the distribution of elements (Ni, Cr, Mo, Cu, O, Si, Sn, Al) in four base alloys. The following results were obtained: 1. The thickness of the oxidized layer of Rexillium III alloy and Unitbond alloy (contained beryllium) was thinner than Unibond alloy and Wiron 88 alloy (no beryllium). 2. The thickness of the oxidized layer of alloys in air (10 minutes and 30 minutes) was thinner in Unitbond (2.45 microns and 3.80 microns) and thicker in Wiron 88 (4.39 microns and 5.96 microns). 3. The thickness of the oxidized layer occurring for a duration of ten minutes (in vaccum) showed that the Rexillium III alloy was the thinnest (1.93 microns), and Wiron 88 alloy was the thickest (2.30 microns). But in thirty minutes (vacuum), Unitbond alloy was the thinnest (3.37 microns), and Wiron 88 alloy was the thickest (5.51 microns). 4. The intensity of Cr elements was increased obviously near the interface between Unitbond alloy, Wiron 88 alloy (no beryllium) and oxidized layer, but the intensity of Ni and Mo elements was slightly increased. The intensity of Cr element was not increased markedly between Rexillium III alloy, Unitbond alloy (beryllium) and oxidized layer. 5. A white-grayish oxidized layer appeared at the metal-ceramic interfaces but the thickness of oxidized layer was not obviously different. 6. The use of bonding agent at metal-ceramic interface leads to the deposition of many Sn elements at about 40 microns range within the porcelain surface. 7. Second interaction phases at the porcelain layer appeared when gold bonding agent was used, and a 50-100 microns microleakage occurred at the metal-ceramic interface.
由于价格较低、硬度高、拉伸强度高和弹性模量高，近年来贱金属合金在烤瓷熔附金属冠桥中的应用有所增加。向贱金属合金中添加铍可提高流动性并改善铸造适应性。铍还能控制表面氧化和结合强度。粘结剂和金粘结剂也会影响瓷与金属合金之间的结合强度。研究了四种市售陶瓷基合金（两种合金含有铍元素，另外两种不含）。本研究的目的是研究瓷基体、粘结剂和合金基体界面之间的微观结构。使用扫描电子微探针分析仪和能量色散X射线光谱仪（EDXS）研究四种基合金中元素（镍、铬、钼、铜、氧、硅、锡、铝）的分布。得到以下结果：1. Rexillium III合金和Unitbond合金（含铍）的氧化层厚度比Unibond合金和Wiron 88合金（不含铍）薄。2. 在空气中（10分钟和30分钟）合金的氧化层厚度，Unitbond合金较薄（2.45微米和3.80微米），Wiron 88合金较厚（4.39微米和5.96微米）。3. 持续十分钟（真空）时氧化层的厚度表明，Rexillium III合金最薄（1.93微米），Wiron 88合金最厚（2.30微米）。但在三十分钟（真空）时，Unitbond合金最薄（3.37微米），Wiron 88合金最厚（5.51微米）。4. 在Unitbond合金、Wiron 88合金（不含铍）与氧化层之间的界面附近，铬元素的强度明显增加，但镍和钼元素的强度略有增加。在Rexillium III合金、Unitbond合金（含铍）与氧化层之间，铬元素的强度没有明显增加。5. 在金属-陶瓷界面处出现灰白色氧化层，但氧化层厚度没有明显差异。6. 在金属-陶瓷界面使用粘结剂会导致许多锡元素沉积在瓷表面约40微米范围内。7. 使用金粘结剂时，瓷层出现第二相互作用相，在金属-陶瓷界面处出现50-100微米的微渗漏。
