Weikart CM, Miyama M, Yasuda HK
Center for Surface Science and Plasma Technology and Department of Chemical Engineering, University of Missouri-Columbia, Columbia, Missouri, 65211
J Colloid Interface Sci. 1999 Mar 1;211(1):28-38. doi: 10.1006/jcis.1998.5964.
The dynamic wetting properties of TMS (trimethylsilane) and TMS + O2 plasma-deposited films on ten low energy conventional polymers were investigated using the Wilhelmy balance method. Plasma deposition resulted in wetting properties that were independent of the underlying polymer substrate for the majority of polymers studied. TMS plasma modification resulted in virtually the same degree of hydrophobicity with an average cosine of the dynamic advancing contact angle from the first immersion, cos θD,a,1 = -0.381 (θD,a,1 = 112 +/- 3.6), for eight of the ten polymers. PTFE and UHMWPE were slightly more hydrophobic after TMS plasma treatment with an average cos θD,a,1 = -0.785 (θD,a,1 = 141 +/- 4.2). TMS + O2 plasma modification resulted in high wettability of all polymers with an average cos θD,a,1 = 0.654 (θD,a,1 = 49.2 +/- 11.7). Dynamic hysteresis, mainly a result of the change in meniscus shape during immersion and emersion, and intrinsic hysteresis, due to the extent of surface configuration change, were both found to vary according to the size of the polymer plate. In general, dynamic hysteresis can be quite large for more hydrophobic TMS treated polymers and considerably smaller for highly hydrophilic TMS + O2 treated polymers. The extent of intrinsic hysteresis of only TMS treated polymers was found to be independent of the underlying polymers within the time-scale of wetting. TMS + O2 plasma treatment resulted in wide variations in intrinsic hysteresis probably due to substrate specific etching of oxygen plasma species. The wettability of the untreated and TMS and TMS + O2 treated polymers, indicated by the static "advancing" contact angles from the sessile droplet method and dynamic "advancing" and "receding" contact angles from the Wilhelmy balance method, were found to conform well to the correlation, cos θS = (cos θD,a,1 + cos θD,r,1)/2. Copyright 1999 Academic Press.
采用威尔海姆天平法研究了三甲基硅烷(TMS)以及经TMS与氧气等离子体沉积的薄膜在十种低能常规聚合物上的动态润湿性能。对于大多数所研究的聚合物而言,等离子体沉积所产生的润湿性能与底层聚合物基材无关。TMS等离子体改性使十种聚合物中的八种具有几乎相同程度的疏水性,首次浸入时动态前进接触角的平均余弦值cosθD,a,1 = -0.381(θD,a,1 = 112±3.6)。聚四氟乙烯(PTFE)和超高分子量聚乙烯(UHMWPE)在TMS等离子体处理后疏水性略强,平均cosθD,a,1 = -0.785(θD,a,1 = 141±4.2)。TMS + O2等离子体改性使所有聚合物具有高润湿性,平均cosθD,a,1 = 0.654(θD,a,1 = 49.2±11.7)。动态滞后主要是浸入和脱出过程中弯月面形状变化的结果,而固有滞后则是由于表面构型变化的程度所致,研究发现这两者均会根据聚合物板的尺寸而变化。一般来说,对于疏水性更强的经TMS处理的聚合物,动态滞后可能会相当大,而对于亲水性很强的经TMS + O2处理的聚合物,动态滞后则会小得多。发现在润湿时间尺度内,仅经TMS处理的聚合物的固有滞后程度与底层聚合物无关。TMS + O2等离子体处理导致固有滞后存在很大差异,这可能是由于氧等离子体物质对基材的特定蚀刻所致。通过静滴法得到的静态“前进”接触角以及通过威尔海姆天平法得到的动态“前进”和“后退”接触角表明,未处理的以及经TMS和TMS + O2处理的聚合物的润湿性与如下相关性很好地相符:cosθS = (cosθD,a,1 + cosθD,r,1)/2。版权所有1999年学术出版社。