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一组丝状真菌中热休克因子的组成型和热诱导型热休克元件结合活性

Constitutive and heat-inducible heat shock element binding activities of heat shock factor in a group of filamentous fungi.

作者信息

Xavier I J, Khachatourians G G, Ovsenek N

机构信息

Department of Applied Microbiology and Food Science, University of Saskatchewan, Saskatoon, Canada.

出版信息

Cell Stress Chaperones. 1999 Dec;4(4):211-22. doi: 10.1379/1466-1268(1999)004<0211:cahihs>2.3.co;2.

Abstract

This study represents the initial characterization of the heat shock factor (HSF) in filamentous fungi. We demonstrate that HSFs from Beauveria bassiana, Metarhizium anisopliae, Tolypocladium nivea, Paecilomyces farinosus, and Verticillium lecanii bind to the heat shock element (HSE) constitutively (non-shocked), and that heat shock resulted in increased quantities and decreased mobility of HSF-HSE complexes. The monomeric molecular mass of both heat-induced and constitutive HSFs was determined to be 85.8 kDa by UV-crosslinking and the apparent molecular masses of the native HSF-HSE complexes as determined by pore exclusion gradient gel electrophoresis was 260 and 300 kDa, respectively. Proteolytic band clipping assays using trypsin and chymotrypsin revealed an identical partial cleavage profile for constitutive and heat-induced HSF-HSE complexes. Thus, it appears that both constitutive and heat-inducible complexes are formed by trimers composed of the same HSF molecule which undergoes conformational changes during heat shock. The mobility difference between the complexes was not abolished by enzymatic dephosphorylation and deglycosylation, indicating that the reduced mobility of the heat-induced HSF is probably due to a post-translational modification other than phosphorylation or glycosylation.

摘要

本研究首次对丝状真菌中的热休克因子(HSF)进行了表征。我们证明,球孢白僵菌、绿僵菌、雪白丝枝霉、粉拟青霉和蜡蚧轮枝菌中的HSF组成性地(非热激状态下)与热休克元件(HSE)结合,并且热激导致HSF-HSE复合物数量增加和迁移率降低。通过紫外线交联测定,热诱导型和组成型HSF的单体分子量均为85.8 kDa,通过排阻梯度凝胶电泳测定,天然HSF-HSE复合物的表观分子量分别为260 kDa和300 kDa。使用胰蛋白酶和胰凝乳蛋白酶的蛋白水解条带切割试验显示,组成型和热诱导型HSF-HSE复合物具有相同的部分切割图谱。因此,组成型和热诱导型复合物似乎都是由相同HSF分子组成的三聚体形成的,该分子在热激过程中发生构象变化。复合物之间的迁移率差异不会因酶促去磷酸化和去糖基化而消除,这表明热诱导型HSF迁移率降低可能是由于除磷酸化或糖基化以外的翻译后修饰。

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