Tsujino J, Yoshihara H, Sano T, Ihara S
Faculty of Engineering, Kanagawa University, Yokohama, Japan.
Ultrasonics. 2000 Mar;38(1-8):77-80. doi: 10.1016/s0041-624x(99)00173-0.
The vibration characteristics of longitudinal-complex transverse vibration systems with multiple resonance frequencies of 350-980 kHz for ultrasonic wire bonding of IC, LSI or electronic devices were studied. The complex vibration systems can be applied for direct welding of semiconductor tips (face-down bonding, flip-chip bonding) and packaging of electronic devices. A longitudinal-complex transverse vibration bonding system consists of a complex transverse vibration rod, two driving longitudinal transducers 7.0 mm in diameter and a transverse vibration welding tip. The vibration distributions along ceramic and stainless-steel welding tips were measured at up to 980 kHz. A high-frequency vibration system with a height of 20.7 mm and a weight of less than 15 g was obtained.
研究了用于集成电路、大规模集成电路或电子器件超声引线键合的具有350 - 980 kHz多个共振频率的纵向 - 复合横向振动系统的振动特性。该复合振动系统可应用于半导体芯片的直接焊接（倒装芯片键合、倒装芯片焊接）和电子器件的封装。纵向 - 复合横向振动键合系统由一个复合横向振动杆、两个直径7.0 mm的驱动纵向换能器和一个横向振动焊接头组成。在高达980 kHz的频率下测量了沿陶瓷和不锈钢焊接头的振动分布。获得了一个高度为20.7 mm、重量小于15 g的高频振动系统。
