Tsujino Jiromaru, Harada Yoshiki, Ihara Shigeru, Kasahara Kohei, Shimizu Masanori, Ueoka Tetsugi
Faculty of Engineering, Kanagawa University, 3-27-1 Rokkakubashi, Kanagawa-ku, Yokohama 221-8686, Japan.
Ultrasonics. 2004 Apr;42(1-9):125-9. doi: 10.1016/j.ultras.2004.02.011.
Ultrasonic high-frequency complex vibrations are effective for various ultrasonic high-power applications. Three types of ultrasonic complex vibration system with a welding tip vibrating elliptical to circular locus for packaging in microelectronics were studied. The complex vibration sources are using (1) a longitudinal-torsional vibration converter with diagonal slits that is driven only by a longitudinal vibration source, (2) a complex transverse vibration rod with several stepped parts that is driven by two longitudinal vibration source crossed at a right angle and (3) a longitudinal vibration circular disk and three longitudinal transducers that are installed at the circumference of the disk.
超声高频复合振动对各种超声高功率应用有效。研究了三种用于微电子封装的、焊头振动轨迹为椭圆形至圆形的超声复合振动系统。复合振动源使用：（1）一种带有对角缝的纵向-扭转振动换能器，仅由纵向振动源驱动；（2）一种带有多个阶梯部分的复合横向振动棒，由两个成直角交叉的纵向振动源驱动；（3）一个纵向振动圆盘和三个安装在圆盘圆周上的纵向换能器。
