Peng J S, Tsai W C, Chou C C
Graduate Institute of Food Science and Technology, National Taiwan University, Taipei.
Int J Food Microbiol. 2001 Apr 11;65(1-2):105-11. doi: 10.1016/s0168-1605(00)00517-1.
The ability of a Bacillus cereus strain, isolated from spoiled milk, to adhere to the surface of stainless steel chips was evaluated during its growth in diluted tryptic soy broth (DTSB). The number of cells that adhered to the surface increased markedly as the culture reached the end of the log phase and entered stationary phase, and continued to increase with further incubation. The surface properties of cells from the log, stationary, and late stationary phases were measured by hydrophobic interaction chromatography (HIC) and electrostatic interaction chromatography (ESIC). It was found that surface hydrophobicity of B. cereus vegetative cells from the late stationary phase was the highest followed by those from the stationary phase and the log phase cultures. While the vegetative cells prepared from stationary phase and log phase cultures, respectively, had the highest and the lowest surface charges. Adhesion of B. cereus vegetative cells to stainless steel was positively correlated with the cell surface hydrophobicity (R = 0.979). Surface hydrophobicity and surface positive charge noted on the spores harvested from diluted tryptic soy agar (DTSA) and Mn2+-tryptone glucose extract agar were higher than those harvested from the sucrose or lactose-added DTSA. A wide variation in the surface charge values was noted on the surface of various spores prepared from cultures grown on the four different media tested, while their ability to adhere to stainless steel chips in phosphate buffered saline (PBS) showed no significant difference (p > 0.05). Similarly, the number of spores or vegetative cells adhering to stainless steel suspended in PBS, milk or diluted milk (1000 x) did not differ significantly (p > 0.05).
对从变质牛奶中分离出的一株蜡样芽孢杆菌在稀释胰蛋白胨大豆肉汤（DTSB）中生长期间黏附不锈钢芯片表面的能力进行了评估。随着培养物到达对数期末期并进入稳定期，黏附在表面的细胞数量显著增加，并随着进一步孵育继续增加。通过疏水相互作用色谱法（HIC）和静电相互作用色谱法（ESIC）测定了对数期、稳定期和稳定后期细胞的表面性质。发现稳定后期蜡样芽孢杆菌营养细胞的表面疏水性最高，其次是稳定期和对数期培养物中的细胞。而分别由稳定期和对数期培养物制备的营养细胞具有最高和最低的表面电荷。蜡样芽孢杆菌营养细胞对不锈钢的黏附与细胞表面疏水性呈正相关（R = 0.979）。从稀释胰蛋白胨大豆琼脂（DTSA）和Mn2 + -胰蛋白胨葡萄糖提取物琼脂收获的孢子上观察到的表面疏水性和表面正电荷高于从添加蔗糖或乳糖的DTSA收获的孢子。在由在四种不同测试培养基上生长的培养物制备的各种孢子表面观察到表面电荷值有很大差异，而它们在磷酸盐缓冲盐水（PBS）中黏附不锈钢芯片的能力没有显著差异（p > 0.05）。同样，黏附在悬浮于PBS、牛奶或稀释牛奶（1000倍）中的不锈钢上的孢子或营养细胞数量没有显著差异（p > 0.05）。
