Wang M, Zhong S, Yin X B, Zhu J M, Peng R W, Wang Y, Zhang K Q, Ming N B
National Laboratory of Solid State Microstructures and Department of Physics, Nanjing University, Nanjing 210093, China.
Phys Rev Lett. 2001 Apr 23;86(17):3827-30. doi: 10.1103/PhysRevLett.86.3827.
In this Letter we report a novel self-organized copper electrodeposition in an ultrathin layer of CuSO4 electrolyte. The macroscopic fingering branches of the deposit consist of long copper filaments covered with periodic corrugated nanostructures. The mechanism of the nanostructure formation is explored and the origin of the significant descent of the branching rate in electrodeposition is discussed. We suggest that this growth phenomenon provides deeper insights into the role of diffusion and migration on pattern formation in electrodeposition.
在本信函中，我们报道了在超薄硫酸铜电解质层中一种新型的自组织铜电沉积现象。沉积物的宏观指状分支由覆盖着周期性波纹纳米结构的长铜丝组成。我们探究了纳米结构的形成机制，并讨论了电沉积过程中分支速率显著下降的原因。我们认为，这种生长现象为深入了解扩散和迁移在电沉积图案形成中的作用提供了新的视角。
