Weng Yu-Yan, Si Jian-Wen, Gao Wen-Ting, Wu Zhe, Wang Mu, Peng Ru-Wen, Ming Nai-Ben
National Laboratory of Solid State Microstructures and Department of Physics, Nanjing University, Nanjing 210093, China.
Phys Rev E Stat Nonlin Soft Matter Phys. 2006 May;73(5 Pt 1):051601. doi: 10.1103/PhysRevE.73.051601. Epub 2006 May 1.
We report here a self-organized electroless deposition of copper in an ultrathin layer CuSO4 of electrolyte. Microscopically the branching rate of the copper deposits is significantly decreased, forming an array of smooth polycrystalline filaments. Compared with a conventional electrodeposition system, no macroscopic electric field is involved and the thickness of the electrolyte layer is greatly decreased. Therefore the electroless deposition takes place in a nearly ideal, two-dimensional diffusion-limited environment. We suggest that restriction of the thickness of the electrolyte film is responsible for the generation of smoother branches of the electrodeposits. Our data also show that even in a diffusion-limited scenario the aggregate morphology is not necessarily very ramified and fractal-like.
我们在此报告了在超薄层硫酸铜电解质中进行的铜自组织化学沉积。从微观上看，铜沉积物的分支速率显著降低，形成了一系列光滑的多晶细丝阵列。与传统的电沉积系统相比，该过程不涉及宏观电场，并且电解质层的厚度大大减小。因此，化学沉积发生在近乎理想的二维扩散受限环境中。我们认为，电解质膜厚度的限制是电沉积物产生更平滑分支的原因。我们的数据还表明，即使在扩散受限的情况下，聚集体形态也不一定非常分支且呈分形状。
