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一种用于玻璃电泳微芯片制造中的紫外线键合方法。

A method for UV-bonding in the fabrication of glass electrophoretic microchips.

作者信息

Huang Z, Sanders J C, Dunsmor C, Ahmadzadeh H, Landers J P

机构信息

Department of Chemistry University of Virginia Health Sciences Center, Charlottesville 22904, USA.

出版信息

Electrophoresis. 2001 Oct;22(18):3924-9. doi: 10.1002/1522-2683(200110)22:18<3924::AID-ELPS3924>3.0.CO;2-4.

DOI:10.1002/1522-2683(200110)22:18<3924::AID-ELPS3924>3.0.CO;2-4
PMID:11700722
Abstract

This paper presents an approach for the development of methodologies amenable to simple and inexpensive microchip fabrication, potentially applicable to dissimilar materials bonding and chip integration. The method involves a UV-curable glue that can be used for glass microchip fabrication bonding at room temperature. This involves nothing more than fabrication of glue "guide channels" into the microchip architecture that upon exposure to the appropriate UV light source, bonds the etched plate and cover plate together. The microchip performance was verified by capillary zone electrophoresis (CZE) of small fluorescent molecules with no microchannel surface modification carried out, as well as with a DNA fragment separation following surface modification. The performance of these UV-bonded electrophoretic microchips indicates that this method may provide an alternative to high temperature bonding.

摘要

本文提出了一种开发适用于简单且低成本微芯片制造方法的途径,该方法可能适用于不同材料的键合和芯片集成。该方法涉及一种可在室温下用于玻璃微芯片制造键合的紫外光固化胶水。这仅仅是在微芯片结构中制造胶水“引导通道”,当暴露于适当的紫外光源时,将蚀刻板和盖板粘结在一起。通过对小型荧光分子进行毛细管区带电泳(CZE)验证了微芯片的性能,其中未对微通道表面进行改性,以及在表面改性后对DNA片段进行分离。这些紫外键合电泳微芯片的性能表明,该方法可能为高温键合提供一种替代方案。

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