Klocke Arndt, Korbmacher Heike M, Huck Lothar G, Ghosh Joydeep, Kahl-Nieke Bärbel
Department of Orthodontics, College of Dentistry, University of Hamburg, 20246 Hamburg, Germany.
Am J Orthod Dentofacial Orthop. 2003 Sep;124(3):309-15. doi: 10.1016/s0889-5406(03)00310-x.
The aim of this in vitro investigation was to evaluate bond strength and debonding characteristics when a xenon plasma arc curing light is used to bond polycrystalline and monocrystalline ceramic brackets. Brackets were bonded to 240 extracted bovine mandibular incisors with a composite adhesive. Curing intervals of 1, 3, and 6 seconds were chosen for curing with the plasma arc light, and the control group was cured at 10 seconds per bracket with a conventional halogen light. Debonding was performed on a universal testing machine and according to the bracket manufacturers' recommendations. Both the polycrystalline and the monocrystalline brackets consistently debonded at the bracket-adhesive interface, regardless of debonding method, curing interval, or curing light. No enamel fractures were observed after debonding. Bracket fractures were rare and did not affect debonding. Bond strength was significantly higher for the monocrystalline brackets (P <.0001): mean shear bond strength ranged between 9.68 +/- 2.17 MPa (plasma arc curing light, 1 sec curing interval) and 10.73 +/- 3.22 MPa (halogen light, 10 sec curing interval) for the polycrystalline brackets and between 19.85 +/- 2.97 MPa (plasma arc curing light, 1 sec curing interval) and 22.94 +/- 3.20 MPa (plasma arc curing light, 3 sec curing interval) for the monocrystalline brackets. Significant differences were also found for the curing methods used (P =.047). A curing interval of 3 seconds with the plasma arc curing light is recommended for both polycrystalline and monocrystalline ceramic brackets.
本体外研究的目的是评估使用氙气等离子弧固化灯粘结多晶和单晶陶瓷托槽时的粘结强度和脱粘特性。使用复合粘结剂将托槽粘结到240颗拔除的牛下颌切牙上。选择1秒、3秒和6秒的固化时间用等离子弧光进行固化，对照组使用传统卤素灯每颗托槽固化10秒。在万能试验机上按照托槽制造商的建议进行脱粘。无论脱粘方法、固化时间或固化灯如何，多晶和单晶托槽均始终在托槽-粘结剂界面脱粘。脱粘后未观察到釉质骨折。托槽骨折很少见，且不影响脱粘。单晶托槽的粘结强度显著更高（P<.0001）：多晶托槽的平均剪切粘结强度在9.68±2.17MPa（等离子弧固化灯，1秒固化时间）和10.73±3.22MPa（卤素灯，10秒固化时间）之间，单晶托槽的平均剪切粘结强度在19.85±2.97MPa（等离子弧固化灯，1秒固化时间）和22.94±3.20MPa（等离子弧固化灯，3秒固化时间）之间。所用固化方法也存在显著差异（P =.047）。对于多晶和单晶陶瓷托槽，建议使用等离子弧固化灯固化3秒。
