Stanley Leah C, Ogden Kimberly L
Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ 85721, USA.
J Environ Manage. 2003 Nov;69(3):289-97. doi: 10.1016/j.jenvman.2003.09.009.
Copper Chemical Mechanical Planarization (Cu-CMP) is a critical step in integrated circuit (IC) device manufacturing. CMP and post-CMP cleaning processes are projected to account for 30-40% of the water consumed by IC manufacturers in 2003. CMP wastewater is expected to contain increasing amounts of copper as the industry switches from Al-CMP to Cu-CMP causing some IC manufacturers to run the risk of violating discharge regulations. There are a variety of treatment schemes currently available for the removal of heavy metals from CMP wastewater, however, many introduce additional chemicals to the wastewater, have large space requirements, or are expensive. This work explores the use of microorganisms for waste treatment. A Staphylococcus sp. of bacteria was isolated and studied to determine the feasibility for use in removing copper from Cu-CMP wastewater. A model Cu-CMP wastewater was developed and tested, as well as actual Cu-CMP wastes. Continuous-flow packed column experiments were performed to obtain adsorption data and show copper recovery from the waste. A predictive, empirical model was used to accurately describe Cu removal. Additionally, the immobilized cells were regenerated, allowing for the concentration and potential recovery of copper from the wastewater.
铜化学机械抛光（Cu-CMP）是集成电路（IC）器件制造中的关键步骤。预计2003年化学机械抛光及化学机械抛光后的清洗工艺将占IC制造商用水量的30%-40%。随着行业从铝化学机械抛光转向铜化学机械抛光，化学机械抛光废水所含铜量预计会增加，这使得一些IC制造商面临违反排放规定的风险。目前有多种处理方案可用于去除化学机械抛光废水中的重金属，然而，许多方案会向废水中引入额外的化学物质，需要较大的空间，或者成本高昂。这项工作探索了利用微生物进行废水处理。分离并研究了一种葡萄球菌，以确定其用于从铜化学机械抛光废水中去除铜的可行性。开发并测试了一种模拟铜化学机械抛光废水以及实际的铜化学机械抛光废料。进行了连续流填充柱实验以获取吸附数据并展示从废料中回收铜的情况。使用了一个预测性的经验模型来准确描述铜的去除情况。此外，固定化细胞得以再生，从而实现了从废水中浓缩并可能回收铜。
