Oh Keun-Taek, Kim Kyoung-Nam
Department of Dental Biomaterials and Bioengineering and Research Center for Orofacial Hard Tissue Regeneration, College of Dentistry, Yonsei University, 134 Shinchon-Dong, Seodaemun-Gu, Seoul, 120-752, South Korea.
J Biomed Mater Res B Appl Biomater. 2004 Aug 15;70(2):318-31. doi: 10.1002/jbm.b.30046.
In recent years, dental implants have been widely used for the aesthetic and functional restoration of edentulous patients. Dental implants and restorative alloys are required with high corrosion resistance. Suprastructures and implants of different compositions in electrical contact may develop galvanic or coupled corrosion problems. In addition to galvanic corrosion, crevice and pitting corrosion may occur in the marginal gap between dental implant assemblies. In this study, gold, silver-palladium, cobalt-chromium, and nickel-chromium suprastructures were used to investigate their galvanic and crevice corrosion characteristics in combination with titanium (Ti) implants. Potentiodynamic and potentiostatic testing were performed in artificial saliva at 37 degrees C. Potentiodynamic testing was carried out at the potential scan rate of 1 mV/s in the range of -600-1600 mV (SCE). Potentiostatic testing was performed with an open-circuit potential and current densities at -250, 0, and 250 mV (SCE) in artificial saliva. After electrochemical testing, surface morphologies and cross-sections were examined using micrographs of the samples. Potentiodynamic test results indicated that suprastructure/Ti implant couples produced passive current densities in the range of 0.5-12 microA/cm(2); Ti abutment/Ti implant and gold/Ti implant couples exhibited relatively low passive current densities; Co-Cr/Ti implant couples the highest. Co-Cr and Ni-Cr/Ti implant couples showed breakdown potentials of 700 and 570 mV (SCE), respectively. The open-circuit potentials of silver, Ti abutment, gold, Ni-Cr, and Co-Cr/Ti implant couples were -93.2 +/- 93.9, -123.7 +/- 58.8, -140.0 +/- 80.6, -223.5 +/- 35.1, and -312.7 +/- 29.8 mV (SCE), respectively, and did not change with immersion time. The couples exhibited cathodic current densities at -250 mV (SCE); in particular, gold and silver alloys showed high cathodic current densities of -3.18 and -6.63 microA/cm(2), respectively. At 250 mV (SCE), Ti abutment/Ti implant couples exhibited a minimum current density of 9.48 x 10(-2) microA/cm(2), but gold, Ni-Cr, Co-Cr, and silver/Ti implant couples exhibited 0.313, 1.27, 5.60, and 8.06 microA/cm(2), respectively. All couples exhibited relatively low current densities at 0 mV (SCE). Photomicrographs after electrochemical testing showed crevice or pitting corrosion in the marginal gap and at the suprastructure surface. Although of the tested samples Co-Cr/Ti implant couples showed the possibility of galvanic corrosion, its degree was not significant. However, it should be borne in mind that galvanic corrosion can accelerate localized corrosion, such as crevice or pitting corrosion.
近年来,牙种植体已被广泛用于无牙患者的美学和功能修复。牙种植体和修复合金需要具有高耐腐蚀性。不同成分的上部结构和种植体在电接触时可能会出现电偶腐蚀或耦合腐蚀问题。除电偶腐蚀外,牙种植体组件之间的边缘间隙还可能发生缝隙腐蚀和点蚀。在本研究中,使用金、银钯、钴铬和镍铬上部结构来研究它们与钛(Ti)种植体结合时的电偶腐蚀和缝隙腐蚀特性。在37℃的人工唾液中进行动电位和恒电位测试。动电位测试在-600 - 1600 mV(SCE)范围内以1 mV/s的电位扫描速率进行。在人工唾液中,以开路电位和-250、0和250 mV(SCE)的电流密度进行恒电位测试。电化学测试后,使用样品的显微照片检查表面形态和横截面。动电位测试结果表明,上部结构/Ti种植体偶对产生的钝态电流密度在0.5 - 12 μA/cm²范围内;Ti基台/Ti种植体和金/Ti种植体偶对表现出相对较低的钝态电流密度;Co-Cr/Ti种植体偶对的最高。Co-Cr和Ni-Cr/Ti种植体偶对的击穿电位分别为700和570 mV(SCE)。银、Ti基台、金、Ni-Cr和Co-Cr/Ti种植体偶对的开路电位分别为-93.2±93.9、-123.7±58.8、-140.0±80.6、-223.5±35.1和-312.7±29.8 mV(SCE),并且不随浸泡时间变化。这些偶对在-250 mV(SCE)时表现出阴极电流密度;特别是,金和银合金分别表现出-3.18和-6.63 μA/cm²的高阴极电流密度。在250 mV(SCE)时,Ti基台/Ti种植体偶对表现出9.48×10⁻² μA/cm²的最小电流密度,但金、Ni-Cr、Co-Cr和银/Ti种植体偶对分别表现出0.313、1.27、5.60和8.06 μA/cm²。所有偶对在0 mV(SCE)时都表现出相对较低的电流密度。电化学测试后的显微照片显示边缘间隙和上部结构表面存在缝隙腐蚀或点蚀。尽管在所测试的样品中Co-Cr/Ti种植体偶对显示出电偶腐蚀的可能性,但其程度并不显著。然而,应该记住,电偶腐蚀会加速局部腐蚀, 如缝隙腐蚀或点蚀。