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分子与金属键:在导电表面上电接枝聚合物

Molecule-to-metal bonds: electrografting polymers on conducting surfaces.

作者信息

Palacin Serge, Bureau Christophe, Charlier Julienne, Deniau Guy, Mouanda Brigitte, Viel Pascal

机构信息

CEA/DSM/DRECAM/SPCSI, Chimie des Surfaces et Interfaces CEA Saclay, Bât 466, 91191 Gif-sur-Yvette Cedex, France.

出版信息

Chemphyschem. 2004 Oct 18;5(10):1468-81. doi: 10.1002/cphc.200301202.

Abstract

Electrografting is a powerful and versatile technique for modifying and decorating conducting surfaces with organic matter. Mainly based on the electro-induced polymerization of dissolved electro-active monomers on metallic or semiconducting surfaces, it finds applications in various fields including biocompatibility, protection against corrosion, lubrication, soldering, functionalization, adhesion, and template chemistry. Starting from experimental observations, this Review highlights the mechanism of the formation of covalent metal-carbon bonds by electro-induced processes, together with major applications such as derivatization of conducting surfaces with biomolecules that can be used in biosensing, lubrication of low-level electrical contacts, reversible trapping of ionic waste on reactive electrografted surfaces as an alternative to ion-exchange resins, and localized modification of conducting surfaces, a one-step process providing submicrometer grafted areas and which is used in microelectronics.

摘要

电嫁接是一种用有机物修饰和装饰导电表面的强大且通用的技术。它主要基于溶解的电活性单体在金属或半导体表面的电诱导聚合,在生物相容性、防腐蚀、润滑、焊接、功能化、粘附和模板化学等各个领域都有应用。从实验观察出发,本综述重点介绍了通过电诱导过程形成共价金属 - 碳键的机制,以及主要应用,如用可用于生物传感的生物分子对导电表面进行衍生化、对低电平电触点进行润滑、在反应性电嫁接表面上可逆捕获离子废物以替代离子交换树脂,以及对导电表面进行局部修饰,这是一种提供亚微米级嫁接区域的一步法工艺,用于微电子领域。

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