Rosner M, Neubauer E, Eisenmenger-Sittner C, Bangert H, Hutter H
Institute for Chemical Technologies and Analytics, Division of Analytical Chemistry, Vienna University of Technology, Getreidemarkt 9/E164, Vienna 1060, Austria.
Anal Bioanal Chem. 2004 Nov;380(5-6):838-42. doi: 10.1007/s00216-004-2827-3.
The adhesion of copper coatings to carbon substrates is very poor, because of lack of diffusion or reaction between the constituents. Because there is technological interest in enhancing the adhesion and improving the interface between copper and carbon, plasma treatment of the carbon substrate was employed in this study. For modification of the carbon surface a nitrogen plasma was used. It was confirmed by pull-off tests that the strength of adhesion of the copper coating can be improved by a factor of more than 10 by plasma pretreatment, even after treatment for a very short time (1 min). To obtain more information about the mechanisms of the processes occurring at the interface SIMS investigations were performed on samples which had been treated for different times (between 1 and 60 min). These measurements confirmed that nitrogen is located on the interface. With increasing pretreatment time the amount of nitrogen detected on the interface increased. Besides characterisation of as-deposited samples, another focus was to study the mechanisms of diffusion of nitrogen if the samples are heat treated at 500 degrees C.
铜涂层与碳基底之间的附着力非常差，这是由于其组分之间缺乏扩散或反应。鉴于增强铜与碳之间的附着力并改善其界面具有技术意义，本研究采用了对碳基底进行等离子体处理的方法。为了对碳表面进行改性，使用了氮等离子体。通过拉伸试验证实，即使在非常短的时间（1分钟）处理后，通过等离子体预处理，铜涂层的附着力强度也可提高10倍以上。为了获取更多关于界面处发生的过程机制的信息，对经过不同时间（1至60分钟）处理的样品进行了二次离子质谱（SIMS）研究。这些测量证实氮位于界面处。随着预处理时间的增加，在界面处检测到的氮量增加。除了对沉积态样品进行表征外，另一个重点是研究在500摄氏度下对样品进行热处理时氮的扩散机制。
