Park Soo-Jin, Lee Hwa-Young
Advanced Materials Division, Korea Research Institute of Chemical Technology, P.O. Box 107, Yusong, Daejeon 305-600, South Korea.
J Colloid Interface Sci. 2005 May 1;285(1):267-72. doi: 10.1016/j.jcis.2004.11.062.
In this work, the effect of atmospheric-pressure plasma treatments on surface properties of polyimide film are investigated in terms of X-ray photoelectron spectroscopy (XPS), contact angles, and atomic force microscopy (AFM). The adhesion characteristics of the film are also studied in the peel strengths of polyimide/copper film. As experimental results, the polyimide surfaces treated by plasma lead to an increase of oxygen-containing functional groups or the polar component of the surface free energy, resulting in improving the adhesion characteristics of the polyimide/copper foil. Also, the roughness of the film surfaces, confirmed by AFM observation, is largely increased. These results can be explained by the fact that the atmospheric-pressure plasma treatment of polyimide surface yields several oxygen complexes in hydrophobic surfaces, which can play an important role in increasing the surface polarity, wettability, and the adhesion characteristics of the polyimide/copper system.
在本工作中，通过X射线光电子能谱（XPS）、接触角和原子力显微镜（AFM）研究了大气压等离子体处理对聚酰亚胺薄膜表面性能的影响。还通过聚酰亚胺/铜薄膜的剥离强度研究了该薄膜的粘附特性。实验结果表明，经等离子体处理的聚酰亚胺表面会导致含氧官能团增加或表面自由能的极性成分增加，从而改善聚酰亚胺/铜箔的粘附特性。此外，通过AFM观察证实，薄膜表面的粗糙度大幅增加。这些结果可以通过以下事实来解释：聚酰亚胺表面的大气压等离子体处理在疏水表面产生了几种氧络合物，这在增加聚酰亚胺/铜体系的表面极性、润湿性和粘附特性方面可以发挥重要作用。
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