Cen-Puc Marco, Schander Andreas, Vargas Gleason Minerva G, Lang Walter
Institute for Microsensors, Actuators and Systems (IMSAS), University of Bremen, 28359 Bremen, Germany.
Polymers (Basel). 2021 Jun 12;13(12):1955. doi: 10.3390/polym13121955.
Polyimide films are currently of great interest for the development of flexible electronics and sensors. In order to ensure a proper integration with other materials and PI itself, some sort of surface modification is required. In this work, microwave oxygen plasma, reactive ion etching oxygen plasma, combination of KOH and HCl solutions, and polyethylenimine solution were used as surface treatments of PI films. Treatments were compared to find the best method to promote the adhesion between two polyimide films. The first selection of the treatment conditions for each method was based on changes in the contact angle with deionized water. Afterward, further qualitative (scratch test) and a quantitative adhesion assessment (peel test) were performed. Both scratch test and peel strength indicated that oxygen plasma treatment using reactive ion etching equipment is the most promising approach for promoting the adhesion between polyimide films.
聚酰亚胺薄膜目前在柔性电子器件和传感器的发展中备受关注。为了确保与其他材料以及聚酰亚胺本身的良好整合，需要进行某种表面改性。在这项工作中，微波氧等离子体、反应离子蚀刻氧等离子体、KOH和HCl溶液的组合以及聚乙烯亚胺溶液被用作聚酰亚胺薄膜的表面处理方法。对这些处理方法进行比较，以找到促进两个聚酰亚胺薄膜之间附着力的最佳方法。每种方法的处理条件的首次选择是基于与去离子水接触角的变化。随后，进行了进一步的定性（划痕试验）和定量附着力评估（剥离试验）。划痕试验和剥离强度均表明，使用反应离子蚀刻设备进行氧等离子体处理是促进聚酰亚胺薄膜之间附着力最有前景的方法。
