Karttunen Antti J, Rowley Richard L, Pakkanen Tapani A
Department of Chemistry, University of Joensuu, P.O. Box 111, FI-80101, Joensuu, Finland.
J Phys Chem B. 2005 Dec 22;109(50):23983-92. doi: 10.1021/jp054295k.
The interactions of Na+ and Cu+ cations with a Cu(111) surface in the presence and absence of water molecules were investigated using cluster models and ab initio methods. Adsorption in aqueous solution was modeled with one to five water molecules around the adsorbing cation. The Cu surface was described with Cu10 and Cu18 cluster models and the computational method was MP2/RECP/6-31+G. The effect of the basis set superposition error (BSSE) was taken into account with counterpoise (CP) correction, and the accuracy of HF-level results was examined. The interactions between Na+ and the Cu surface were found to be primarily electrostatic, and the energy differences among the different adsorption sites were small. The largest CP-corrected MP2 adsorption energy for the Cu18 cluster was -188 kJ/mol. When water molecules were added around it, Na+ receded from the Cu surface and finally was surrounded totally by the water molecules. The interactions between Cu+ and the Cu surface were dominated by orbital interactions, and Cu+ preferred to adsorb on sites where it could bind to more than one surface atom. The largest CP-corrected MP2 adsorption energy for the Cu18 cluster was -447 kJ/mol. Adding water molecules around it did not cause Cu+ to draw away from the surface, but instead the water molecules began to form hydrogen bonds with one another. The magnitude of BSSE was substantial in most cases. CP corrections did not, however, have a significant impact on the relative trends among the interaction energies.
利用团簇模型和从头算方法研究了在有水分子和无水分子存在的情况下,Na⁺和Cu⁺阳离子与Cu(111)表面的相互作用。用围绕吸附阳离子的一到五个水分子对水溶液中的吸附进行建模。用Cu10和Cu18团簇模型描述Cu表面,计算方法为MP2/RECP/6 - 31 + G。用平衡校正(CP)考虑基组重叠误差(BSSE)的影响,并检验了HF水平结果的准确性。发现Na⁺与Cu表面之间的相互作用主要是静电作用,不同吸附位点之间的能量差异较小。Cu18团簇的最大CP校正MP2吸附能为 - 188 kJ/mol。当在其周围添加水分子时,Na⁺从Cu表面后退,最终完全被水分子包围。Cu⁺与Cu表面之间的相互作用以轨道相互作用为主,Cu⁺更喜欢吸附在能与多个表面原子结合的位点上。Cu18团簇的最大CP校正MP2吸附能为 - 447 kJ/mol。在其周围添加水分子不会导致Cu⁺从表面脱离,相反,水分子开始相互形成氢键。在大多数情况下,BSSE的量级很大。然而,CP校正对相互作用能之间的相对趋势没有显著影响。