Donaldson N D
MRC Neurological Prostheses Unit, London, UK.
Med Biol Eng Comput. 1992 Jan;30(1):63-8. doi: 10.1007/BF02446195.
Most neuroprostheses which use integrated circuits protect these chip components in a hermetic package. No satisfactory method of sealing such an enclosure has been found which does not use metals. Therefore, in general, the seal is an electrically conducting ring. If induction is used to supply power to this device, this ring will be a 'short-circuited turn' which will affect the performance of the inductive link. In the paper, theory is presented for a model in which the metallic seal is a tertiary inductance, coupled to the primary and secondary. The tertiary has finite Q. Equations for this model are given from which formulae for the gain and efficiency are derived for the particular condition of tuning that the carrier frequency equals the resonant frequency of both the primary and secondary circuits. From the formulae, gain curves are plotted which show how the seal affects the link. However, it is clear that general solutions to the problem are needed if the theory is to be of practical use.
大多数使用集成电路的神经假体将这些芯片组件封装在密封包装中进行保护。尚未找到不使用金属的令人满意的密封这种外壳的方法。因此，一般来说，密封是一个导电环。如果使用感应为该设备供电，这个环将是一个“短路匝”，会影响感应链路的性能。本文提出了一个模型的理论，其中金属密封是一个与初级和次级耦合的第三电感。第三电感具有有限的品质因数。给出了该模型的方程，从中推导出了在载波频率等于初级和次级电路的谐振频率这种特定调谐条件下的增益和效率公式。根据这些公式绘制了增益曲线，展示了密封如何影响链路。然而，如果该理论要实际应用，显然需要该问题的通用解决方案。
