Leung Kar Man, Chan Chit Yiu, Chong Yat Ming, Yao Yuen, Ma Kwok Leung, Bello Igor, Zhang Wen Jun, Lee Shuit Tong
Center Of Super-Diamond and Advanced Films (COSDAF) & Department of Physics and Materials Science, City University of Hong Kong, Kowloon Tong, Hong Kong SAR, China.
J Phys Chem B. 2005 Sep 1;109(34):16272-7. doi: 10.1021/jp051656n.
The growth of cubic boron nitride (cBN) films on bare silicon and amorphous tetrahedral carbon (ta-C) layers prepared on silicon substrates was studied. The cBN films were prepared by radio frequency magnetron sputter deposition at approximately 870 degrees C. The original ta-C interlayers were graphitized and restructured under high temperature and possibly under ion bombardment during BN deposition. The majority of graphitic basal planes were nearly perpendicular to the surface of silicon substrates. The BN films grown on these restructured carbon layers were deposited with higher content of cubic phase and did not show delamination signs. Turbostratic BN (tBN) basal planes extended carbon basal planes and their edges served as cBN nucleation sites. The cBN films grown on textured ta-C interlayers were insensitive to the ambient environment. The residual sp(3)-bonded carbon phase confined in the interlayers probably acts as a diffusion barrier preventing the oxidation of dangling bonds near BN interface and thus precludes weakening the interface as a result of volume expansion. The carbon interlayers also improve the crystallinity of the oriented tBN because they are continuation of carbon graphitic basal planes so that the volume fraction of nitrogen-void (N-void) defects in the sp(2)-bonded BN intermediate layers is reduced. The strong sp(3)-bonded carbon matrix could thereto withstand large compressive stress and facilitates deposition of thicker cBN films.
研究了在裸硅以及在硅衬底上制备的非晶四面体碳(ta-C)层上立方氮化硼(cBN)薄膜的生长情况。cBN薄膜通过射频磁控溅射沉积在约870℃下制备。原始的ta-C中间层在高温下以及可能在BN沉积过程中的离子轰击下发生石墨化和重构。大多数石墨基面几乎垂直于硅衬底表面。在这些重构碳层上生长的BN薄膜立方相含量更高,且未显示分层迹象。乱层BN(tBN)基面扩展了碳基面,其边缘作为cBN成核位点。在织构化ta-C中间层上生长的cBN薄膜对环境不敏感。限制在中间层中的残余sp(3)键合碳相可能起到扩散阻挡层的作用,防止BN界面附近悬空键的氧化,从而避免因体积膨胀而削弱界面。碳中间层还提高了取向tBN的结晶度,因为它们是碳石墨基面的延续,从而降低了sp(2)键合BN中间层中氮空位(N-空位)缺陷的体积分数。强sp(3)键合碳基体因此能够承受较大的压应力,并有利于沉积更厚的cBN薄膜。