Alam J, Noor Mohammad S
Materials Science Research Center of Excellence, Howard University, Washington, District of Columbia 20059, USA.
J Chem Phys. 2006 Jul 28;125(4):44718. doi: 10.1063/1.2220563.
While lightly doped semiconductors are preferred for Schottky contacts, heavily doped semiconductors are preferred for Ohmic contacts. The upper limit of doping for Schottky contacts and the lower limit of doping for Ohmic contacts have not, however, been quantified. To address this problem, the influence of doping induced surface chemistry on the electrical characteristics of Schottky diodes has been studied. Hall measurement, current-voltage measurements, and transmission electron microscopy have been performed. The most remarkable observation of the study is a relationship between the surface dislocation density and the ideality factor of the Schottky diodes. The observation leads to a conclusion that the upper limit of the semiconductor doping for Schottky diodes should be such that it leads to negligible barrier height reduction without the creation of excessive surface dislocation density.
虽然肖特基接触优选使用轻掺杂半导体,但欧姆接触则优选使用重掺杂半导体。然而,肖特基接触的掺杂上限和欧姆接触的掺杂下限尚未量化。为了解决这个问题,研究了掺杂诱导的表面化学对肖特基二极管电学特性的影响。进行了霍尔测量、电流-电压测量和透射电子显微镜检查。该研究最显著的发现是肖特基二极管的表面位错密度与理想因子之间的关系。这一发现得出的结论是,肖特基二极管的半导体掺杂上限应使得在不产生过多表面位错密度的情况下,势垒高度降低可忽略不计。