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含铅电子垃圾是铅污染首饰的一种潜在原料来源。

Leaded electronic waste is a possible source material for lead-contaminated jewelry.

作者信息

Weidenhamer Jeffrey D, Clement Michael L

机构信息

Department of Chemistry, Ashland University, Ashland, OH 44805, USA.

出版信息

Chemosphere. 2007 Oct;69(7):1111-5. doi: 10.1016/j.chemosphere.2007.04.023. Epub 2007 May 25.

Abstract

Highly leaded jewelry, often imported from China, remains widely available in the United States. Leaded electronic waste is exported from the United States to several Asian countries where solder is recovered and circuit boards are stripped of parts in small workshops. To assess whether electronic waste is being recycled into the jewelry, lead, tin and copper content of highly leaded jewelry samples were determined by atomic absorption spectrometry. Sixteen jewelry items previously determined to contain 20-80% lead by weight were analyzed. Samples were digested in nitric acid for analysis of lead and copper, and in aqua regia for analysis of tin. Six samples contained significant amounts of tin, from 20.8% to 29.9% by weight. In addition, copper was a significant minor component of five of these samples (up to 4% by weight). Copper (present at 10-40% by weight in circuit boards) was shown to rapidly move into heated lead-tin solder. The combined lead-tin-copper content of these six items ranges from 93.5% to 100%, suggestive of a solder-based source material. These results are consistent with the hypothesis that recycled circuit board solders are being used to produce some of the heavily leaded imported jewelry sold in the United States. Should this hypothesis be substantiated, it suggests that environmental policies to protect children's health must address both proper recycling of source materials as well as restrictions of the lead content in consumer goods.

摘要

通常从中国进口的高铅含量首饰在美国仍广泛可得。含铅电子垃圾从美国出口到几个亚洲国家,在那里焊料被回收,电路板在小作坊里被拆解零件。为评估电子垃圾是否被回收用于制造首饰,通过原子吸收光谱法测定了高铅含量首饰样品中的铅、锡和铜含量。对先前测定铅含量按重量计为20%-80%的16件首饰进行了分析。样品用硝酸消化以分析铅和铜,用王水消化以分析锡。六个样品含有大量锡,按重量计从20.8%到29.9%。此外,铜是其中五个样品中的重要次要成分(按重量计高达4%)。(在电路板中按重量计含量为10%-40%的)铜被证明能迅速进入加热的铅锡焊料中。这六个样品中铅、锡、铜的总含量在93.5%到100%之间,表明其原料是以焊料为基础的。这些结果与以下假设一致:回收的电路板焊料正被用于生产在美国销售的一些高铅含量的进口首饰。如果这一假设得到证实,这表明保护儿童健康的环境政策必须既要解决原料的正确回收问题,也要解决消费品中铅含量的限制问题。

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