Bermak A, Martinez D
Electr. and Electron. Eng. Dept., Hong Kong Univ. of Sci. and Technol., Kowloon, China.
IEEE Trans Neural Netw. 2003;14(5):1097-109. doi: 10.1109/TNN.2003.816362.
A bagging ensemble consists of a set of classifiers trained independently and combined by a majority vote. Such a combination improves generalization performance but can require large amounts of memory and computation, a serious drawback for addressing portable real-time pattern recognition applications. We report here a compact three-dimensional (3D) multiprecision very large-scale integration (VLSI) implementation of a bagging ensemble. In our circuit, individual classifiers are decision trees implemented as threshold networks - one layer of threshold logic units (TLUs) followed by combinatorial logic functions. The hardware was fabricated using 0.7-/spl mu/m CMOS technology and packaged using MCM-V micro-packaging technology. The 3D chip implements up to 192 TLUs operating at a speed of up to 48 GCPPS and implemented in a volume of (/spl omega/ /spl times/ L /spl times/ h) = (2 /spl times/ 2 /spl times/ 0.7) cm/sup 3/. The 3D circuit features a high level of programmability and flexibility offering the possibility to make an efficient use of the hardware resources in order to reduce the power consumption. Successful operation of the 3D chip for various precisions and ensemble sizes is demonstrated through an electronic nose application.
装袋集成由一组独立训练并通过多数投票进行组合的分类器组成。这种组合提高了泛化性能,但可能需要大量内存和计算资源,这对于解决便携式实时模式识别应用来说是一个严重的缺点。我们在此报告一种装袋集成的紧凑型三维(3D)多精度超大规模集成(VLSI)实现。在我们的电路中,各个分类器是实现为阈值网络的决策树——一层阈值逻辑单元(TLU),后面跟着组合逻辑函数。硬件采用0.7-μm CMOS技术制造,并使用MCM-V微封装技术进行封装。该3D芯片实现了多达192个TLU,运行速度高达48 GCPPS,体积为(ω×L×h)=(2×2×0.7)cm³。该3D电路具有高度的可编程性和灵活性,为有效利用硬件资源以降低功耗提供了可能性。通过电子鼻应用展示了该3D芯片在各种精度和集成规模下的成功运行。