Horowitz Stephen, Nishida Toshikazu, Cattafesta Louis, Sheplak Mark
Department of Mechanical and Aerospace Engineering, Interdisciplinary Microsystems Group, University of Florida, Gainesville, Florida 32611-6250, USA.
J Acoust Soc Am. 2007 Dec;122(6):3428-36. doi: 10.1121/1.2785040.
This paper describes the design, fabrication, and characterization of a bulk-micromachined piezoelectric microphone for aeroacoustic applications. Microphone design was accomplished through a combination of piezoelectric composite plate theory and lumped element modeling. The device consists of a 1.80-mm-diam, 3-microm-thick, silicon diaphragm with a 267-nm-thick ring of piezoelectric material placed near the boundary of the diaphragm to maximize sensitivity. The microphone was fabricated by combining a sol-gel lead zirconate-titanate deposition process on a silicon-on-insulator wafer with deep-reactive ion etching for the diaphragm release. Experimental characterization indicates a sensitivity of 1.66 microVPa, dynamic range greater than six orders of magnitude (35.7-169 dB, re 20 microPa), a capacitance of 10.8 nF, and a resonant frequency of 59.0 kHz.
本文描述了一种用于航空声学应用的体微机械压电麦克风的设计、制造和特性。麦克风设计是通过压电复合板理论和集总元件建模相结合来完成的。该器件由一个直径1.80毫米、厚度3微米的硅膜片组成，在膜片边界附近放置了一个厚度为267纳米的压电材料环，以最大化灵敏度。该麦克风是通过在绝缘体上硅晶圆上进行溶胶 - 凝胶锆钛酸铅沉积工艺与用于释放膜片的深反应离子蚀刻相结合来制造的。实验特性表明其灵敏度为1.66微伏/帕斯卡，动态范围大于六个数量级（35.7 - 169分贝，参考20微帕斯卡），电容为10.8纳法，谐振频率为59.0千赫兹。
