Wynne R, Daneu J L, Fan T Y
Lincoln Laboratory, Massachusetts Institute of Technology, 244 Wood Street, Lexington, Massachusetts 02420, USA.
Appl Opt. 1999 May 20;38(15):3282-4. doi: 10.1364/ao.38.003282.
The thermal expansion coefficient and dn/dT are measured by interferometry techniques in undoped YAG below 300 K. The thermal expansion coefficient at 125 K is measured to be 2.70 x 10(-6) K(-1) and dn/dT at 633 nm is 2.5 x 10(-6) K(-1), compared with 7 x 10(-6) K(-1) and 9 x 10(-6) K(-1) for these quantities at 300 K.
在低于300K的未掺杂YAG中，通过干涉测量技术测量热膨胀系数和dn/dT。在125K时测得热膨胀系数为2.70×10⁻⁶K⁻¹，在633nm处dn/dT为2.5×10⁻⁶K⁻¹，而在300K时这些量分别为7×10⁻⁶K⁻¹和9×10⁻⁶K⁻¹。
