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使用牙周电子测量仪测量牙本质渗透性和湿度。

Measurement of dentin permeability and wetness by use of the Periotron device.

作者信息

Prati C, Erickson R, Tao L, Simpson M, Pashley D H

机构信息

Department of Operative Dentistry, School of Dentistry, University of Bologna.

出版信息

Dent Mater. 1991 Oct;7(4):268-73. doi: 10.1016/S0109-5641(05)80027-2.

DOI:10.1016/S0109-5641(05)80027-2
PMID:1839985
Abstract

The ability of the Periotron device to measure changes in dentin permeability and wetness was evaluated by use of extracted human teeth in vitro. Pulpal pressures were varied from zero to 40 cm H2O for simulation of different pulpal tissue pressures. Non-physiologic pulpal pressures of 703 cm H2O were used for comparison of dentin permeability measurements made with the Periotron device with those made using micropipettes. Measurements made with the Periotron device correlated well with methods used previously for measurement of dentin permeability. The shear bond strength of Scotchbond 2/Silux was measured 24 h after being bonded to dentin held at zero pulpal pressure. There was an inverse correlation between the shear bond strengths of Scotchbond 2/Silux and Periotron values, suggesting that increased wetness decreases the bond strength of that system. The Periotron device offers a new, simple, convenient measure of dentin surface wetness which may be useful in dentin bonding studies.

摘要

通过在体外使用拔除的人牙,评估了Periotron设备测量牙本质渗透性和湿度变化的能力。为模拟不同的牙髓组织压力,将牙髓压力从零变化到40 cm H₂O。使用703 cm H₂O的非生理性牙髓压力,将用Periotron设备进行的牙本质渗透性测量与用微量移液器进行的测量进行比较。用Periotron设备进行的测量与先前用于测量牙本质渗透性的方法相关性良好。在粘结到处于零牙髓压力的牙本质上24小时后,测量Scotchbond 2/Silux的剪切粘结强度。Scotchbond 2/Silux的剪切粘结强度与Periotron值之间存在负相关,表明湿度增加会降低该系统的粘结强度。Periotron设备提供了一种新的、简单、方便的牙本质表面湿度测量方法,这可能在牙本质粘结研究中有用。

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引用本文的文献

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Microtensile dentin adhesive bond strength under different positive pulpal pressures.不同正向牙髓压力下的微拉伸牙本质粘结强度
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