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含硫和磷单体的底漆对IV型金合金粘结的影响。

Effects of primers containing sulfur and phosphate monomers on bonding type IV gold alloy.

作者信息

Taira Yohsuke, Kamada Kohji

机构信息

Department of Applied Prosthodontics, Graduate School of Biomedical Sciences, Nagasaki University, 1-7-1 Sakamoto, Nagasaki, Japan.

出版信息

J Dent. 2008 Aug;36(8):595-9. doi: 10.1016/j.jdent.2008.04.005. Epub 2008 May 21.

Abstract

OBJECTIVE

The purpose of the present study was to evaluate the effect of five primers (two sulfur, one phosphate, and two sulfur-phosphate dual-function primers) on the bond strength between a self-curing luting agent and gold-copper-silver (Au-Cu-Ag) alloy.

METHODS

The primers used were two sulfur primers (V-Primer and Metaltite), one phosphate primer (Epricord), and two primers which contained a sulfur monomer and a phosphate monomer (Alloy Primer and Metaltite/Epricord). The surface of Au-Cu-Ag specimens were blasted with alumina, and then bonded with acrylic rods using a tri-n-butylborane-initiated self-curing luting agent. Shear bond strengths were determined after 5000 thermocycles. An additional alumina-blasted Au-Cu-Ag alloy specimen was subjected to X-ray photoelectron spectroscopy (XPS) analysis.

RESULTS

The maximum shear bond strengths were obtained with Metaltite/Epricord (29.6+/-2.3 MPa) and Alloy Primer (23.0+/-1.6 MPa), followed by Metaltite (10.3+/-4.2 MPa), V-Primer (8.9+/-0.6 MPa), Epricord (6.4+/-1.5 MPa), and No primer control (2.0+/-0.5 MPa). The XPS analysis detected six chemical elements (Au, Cu, Ag, Al, O, and C) on the Au-Cu-Ag alloy. In addition to pure Au element, the metal oxide-states of Ag2O, AgO, Cu2O, and CuO were suggested.

CONCLUSION

The combined use of a sulfur monomer and a phosphate monomer significantly improved the bond strength of resin to Au-Cu-Ag alloy which should be especially significant to clinicians.

摘要

目的

本研究旨在评估五种引物(两种含硫引物、一种含磷引物和两种硫 - 磷双功能引物)对自凝粘接剂与金 - 铜 - 银(Au - Cu - Ag)合金之间粘接强度的影响。

方法

所用引物为两种含硫引物(V - 引物和金属钛)、一种含磷引物(Epricord)以及两种同时含有硫单体和磷单体的引物(合金引物和金属钛/Epricord)。用氧化铝对Au - Cu - Ag试样表面进行喷砂处理,然后使用三正丁基硼烷引发的自凝粘接剂与丙烯酸棒进行粘接。经过5000次热循环后测定剪切粘接强度。另取一个经氧化铝喷砂处理的Au - Cu - Ag合金试样进行X射线光电子能谱(XPS)分析。

结果

金属钛/Epricord(29.6±2.3 MPa)和合金引物(23.0±1.6 MPa)的剪切粘接强度最高,其次是金属钛(10.3±4.2 MPa)、V - 引物(8.9±0.6 MPa)、Epricord(6.4±1.5 MPa)以及无引物对照组(2.0±0.5 MPa)。XPS分析在Au - Cu - Ag合金上检测到六种化学元素(Au、Cu、Ag、Al、O和C)。除了纯Au元素外,还检测到了Ag2O、AgO、Cu2O和CuO的金属氧化物状态。

结论

硫单体和磷单体的联合使用显著提高了树脂与Au - Cu - Ag合金的粘接强度,这对临床医生而言具有重要意义。

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