Taira Yohsuke, Kamada Kohji
Department of Applied Prosthodontics, Graduate School of Biomedical Sciences, Nagasaki University, 1-7-1 Sakamoto, Nagasaki, Japan.
J Dent. 2008 Aug;36(8):595-9. doi: 10.1016/j.jdent.2008.04.005. Epub 2008 May 21.
The purpose of the present study was to evaluate the effect of five primers (two sulfur, one phosphate, and two sulfur-phosphate dual-function primers) on the bond strength between a self-curing luting agent and gold-copper-silver (Au-Cu-Ag) alloy.
The primers used were two sulfur primers (V-Primer and Metaltite), one phosphate primer (Epricord), and two primers which contained a sulfur monomer and a phosphate monomer (Alloy Primer and Metaltite/Epricord). The surface of Au-Cu-Ag specimens were blasted with alumina, and then bonded with acrylic rods using a tri-n-butylborane-initiated self-curing luting agent. Shear bond strengths were determined after 5000 thermocycles. An additional alumina-blasted Au-Cu-Ag alloy specimen was subjected to X-ray photoelectron spectroscopy (XPS) analysis.
The maximum shear bond strengths were obtained with Metaltite/Epricord (29.6+/-2.3 MPa) and Alloy Primer (23.0+/-1.6 MPa), followed by Metaltite (10.3+/-4.2 MPa), V-Primer (8.9+/-0.6 MPa), Epricord (6.4+/-1.5 MPa), and No primer control (2.0+/-0.5 MPa). The XPS analysis detected six chemical elements (Au, Cu, Ag, Al, O, and C) on the Au-Cu-Ag alloy. In addition to pure Au element, the metal oxide-states of Ag2O, AgO, Cu2O, and CuO were suggested.
The combined use of a sulfur monomer and a phosphate monomer significantly improved the bond strength of resin to Au-Cu-Ag alloy which should be especially significant to clinicians.
本研究旨在评估五种引物(两种含硫引物、一种含磷引物和两种硫 - 磷双功能引物)对自凝粘接剂与金 - 铜 - 银(Au - Cu - Ag)合金之间粘接强度的影响。
所用引物为两种含硫引物(V - 引物和金属钛)、一种含磷引物(Epricord)以及两种同时含有硫单体和磷单体的引物(合金引物和金属钛/Epricord)。用氧化铝对Au - Cu - Ag试样表面进行喷砂处理,然后使用三正丁基硼烷引发的自凝粘接剂与丙烯酸棒进行粘接。经过5000次热循环后测定剪切粘接强度。另取一个经氧化铝喷砂处理的Au - Cu - Ag合金试样进行X射线光电子能谱(XPS)分析。
金属钛/Epricord(29.6±2.3 MPa)和合金引物(23.0±1.6 MPa)的剪切粘接强度最高,其次是金属钛(10.3±4.2 MPa)、V - 引物(8.9±0.6 MPa)、Epricord(6.4±1.5 MPa)以及无引物对照组(2.0±0.5 MPa)。XPS分析在Au - Cu - Ag合金上检测到六种化学元素(Au、Cu、Ag、Al、O和C)。除了纯Au元素外,还检测到了Ag2O、AgO、Cu2O和CuO的金属氧化物状态。
硫单体和磷单体的联合使用显著提高了树脂与Au - Cu - Ag合金的粘接强度,这对临床医生而言具有重要意义。