Lee Cheng-Chung, Liao Bo-Huei, Liu Ming-Chung
Department of Optics and Photonics, Thin Film Technology Center, National Central University 320, Taiwan.
Opt Express. 2008 May 12;16(10):6904-9. doi: 10.1364/oe.16.006904.
In this research, the plasma etching mechanism which is applied to deposit AlF(3) thin films has been discussed in detail. Different ratios of O(2) gas were injected in the sputtering process and then the optical properties and microstructure of the thin films were examined. The best optical quality and smallest surface roughness was obtained when the AlF(3) thin films were coated with O(2):CF(4) (12 sccm:60 sccm) at 30 W sputtering power. To increase the deposition rate for industrial application, the sputtering power was increased to 200 W with the best ratio of O(2)/CF(4) gas. The results show that the deposition rate at 200W sputtering power was 7.43 times faster than that at 30 W sputtering power and the extinction coefficients deposited at 200 W are less than 6.8 x 10(-4) at the wavelength range from 190 nm to 700 nm. To compare the deposition with only CF(4) gas at 200 W sputtering power, the extinction coefficient of the thin films improve from 4.4 x 10(-3) to 6 x 10(-4) at the wavelength of 193 nm. In addition, the structure of the film deposited at 200W was amorphous-like with a surface roughness of 0.8 nm.
