Agrawala Paban K, Eschenbrenner Anne, du Penhoat Marie-Anne Herve, Boissiere Arnaud, Politis Marie-Francoise, Touati Alain, Sage Evelyne, Chetioui Annie
Institut de Mineralogie et de Physique de Milieax Condenses, Universite Pierre et Marie Curie-Paris 68, Paris, France.
Int J Radiat Biol. 2008 Dec;84(12):1093-103. doi: 10.1080/09553000802478083.
To investigate the severity of damage induced in plasmid DNA by ultrasoft X-rays at different energies, in order to unravel the correlation between the sharp increase in cell-killing efficiency of ultrasoft X-rays above versus below the carbon K-threshold and the induction of core events in DNA atoms.
Bluescript (pBS, tight packing) and pSP189 (pSP, loose packing) plasmids were exposed to ultrasoft X-rays at 250, 380 and 760 eV energies, respectively, above phosphorus L-, carbon K- and oxygen K-thresholds. Complex DNA lesions were assayed by the repair protein Formamidopyrimidine DNA glycosylase (Fpg) and by in vitro repair assay using whole cell-free extracts.
Clustered damage, as revealed by Fpg-induced double strand breaks, was observed at low level, but at similar rate at the three energies. Damage induced at 380 eV may be slightly less efficiently repaired by cell extracts than those produced at 250 eV. 760 eV photons which yield longer range electrons than 250 and 380 eV photons, induced more total damages which were more efficiently repaired, and thus likely more dispersed.
It is demonstrated that ultrasoft X-rays induce complex damage, which do not exhibit the same ability to be repaired, depending on the energy and on DNA packing.
研究不同能量的极软X射线对质粒DNA造成的损伤严重程度,以揭示极软X射线在碳K阈值以上和以下时细胞杀伤效率急剧增加与DNA原子核心事件诱导之间的相关性。
分别将蓝白斑载体(pBS,紧密包装)和pSP189(pSP,松散包装)质粒暴露于能量为250、380和760 eV的极软X射线下,这些能量分别高于磷L、碳K和氧K阈值。通过修复蛋白甲酰胺嘧啶DNA糖基化酶(Fpg)和使用全细胞无细胞提取物的体外修复试验来检测复杂的DNA损伤。
Fpg诱导的双链断裂所揭示的聚集性损伤在低水平上被观察到,但在三种能量下的发生率相似。与250 eV产生的损伤相比,380 eV诱导的损伤可能被细胞提取物修复的效率略低。760 eV光子产生的电子射程比250和380 eV光子更长,诱导的总损伤更多,且修复效率更高,因此可能更分散。
结果表明,极软X射线会诱导复杂损伤,根据能量和DNA包装情况,这些损伤的修复能力并不相同。