Lee J M, Watkins K
Opt Express. 2000 Jul 17;7(2):68-76. doi: 10.1364/oe.7.000068.
Laser removal of surface oxides and small particles from copper surfaces was carried out using a Q-switched Nd:YAG laser. Oxide layers and small particles on copper surfaces should be removed for the improvement of solder quality on printed circuit boards (PCBs) and for the prevention of circuit failure or loss of production yield during the fabrication of microelectronic devices. A selective removal of surface oxides from a copper surface was achieved by the laser treatment, which was confirmed by on-line acoustic monitoring of the process. An angular laser cleaning technique in which the laser irradiates the surface at a glancing angle was used for effective removal of the particles from the surface. The unique characteristics of this technique and the cleaning mechanism are discussed.
使用调Q Nd:YAG激光对铜表面的表面氧化物和小颗粒进行激光去除。去除铜表面的氧化层和小颗粒，有助于提高印刷电路板（PCB）上的焊接质量，并防止在微电子器件制造过程中出现电路故障或生产良率损失。通过激光处理实现了对铜表面氧化物的选择性去除，这一过程通过在线声学监测得到了证实。采用一种激光以掠射角照射表面的角向激光清洗技术，可有效去除表面颗粒。本文讨论了该技术的独特特性和清洗机制。
