Wang Jianli, Gu Ming, Zhang Xing, Wu Gangping
Department of Engineering Mechanics, Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Tsinghua University, Beijing 100084, People's Republic of China.
Rev Sci Instrum. 2009 Jul;80(7):076107. doi: 10.1063/1.3159863.
The thermal effusivity of a fine wire and the thermal contact resistance of a junction have been measured by a modified T type probe using a periodic heating method. The modified T type probe is made of a short periodic heated platinum wire and a test wire with one end contacting to the midpoint of the hot wire. Dimensionless expressions for the temperature responses of the hot wire with respect to the thermal effusivity of the test wire and the thermal contact resistance of the junction between the test wire and the hot wire were presented. A measurement system based on a flexible resolution A/D board and a LABVIEW-based virtual lock-in was setup. The probe was further verified by measuring four kinds of commercially available metallic wires at room temperature. The obtained thermal contact resistances were repeatable, with the calculated thicknesses of about 1 to 2 microm. The present method can further be applied to measure the thermal effusivity of nonconductive wires, and to analyze the thermal contact resistance of nano/microscale junction.
采用周期性加热方法，利用改进的T型探头测量了细丝的热发射率和结点的热接触电阻。改进的T型探头由一根短的周期性加热铂丝和一根测试线组成，测试线的一端与热线的中点接触。给出了热线温度响应相对于测试线热发射率和测试线与热线之间结点热接触电阻的无量纲表达式。搭建了基于灵活分辨率A/D板和基于LABVIEW的虚拟锁相放大器的测量系统。通过在室温下测量四种市售金属丝对探头进行了进一步验证。所获得的热接触电阻具有可重复性，计算出的厚度约为1至2微米。该方法可进一步应用于测量非导线的热发射率，并分析纳米/微米尺度结点的热接触电阻。
