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在聚二甲基硅氧烷芯片上用区域选择性化学镀制备微金器件。

Preparation of micro gold devices on poly(dimethylsiloxane) chips with region-selective electroless plating.

机构信息

Institute of Microanalytical Systems, Department of Chemistry, Zijin'gang Campus, Zhejiang University, Hangzhou 310058, China.

出版信息

Anal Chem. 2009 Oct 15;81(20):8649-53. doi: 10.1021/ac901539n.

Abstract

A novel protocol for fabrication of micro gold devices on poly(dimethylsiloxane) (PDMS) substrates was developed on the basis of region-selective electroless plating. The layout of a micro gold device was first photochemically patterned onto the PDMS surface through a UV induced poly(acrylic acid) (PAA) grafting process. The carboxylic moieties on the grafted PAA served as the scaffold for a series of wet chemical reactions that led to the immobilization of gold nanoparticles in the UV-exposed region, where electroless plating then occurred under the catalysis of the nanoparticles. Gold devices fabricated with such a protocol could tolerate the Scotch tape test and survive in a repeated bending-straightening test. They also showed good stability in acidic and alkaline solutions, possessed almost the same electrochemical properties as a standard gold disk electrode, and allowed thiol-compounds to form a perfect self-assembled monolayer on their surfaces. The fabricated micro gold electrode was demonstrated to be suitable as the integrated amperometric detection element in a full PDMS micro electrophoresis chip.

摘要

提出了一种在聚二甲基硅氧烷(PDMS)基底上通过选择性化学镀制备微金器件的新方法。该方法基于区域选择性化学镀。首先,通过紫外光诱导聚丙烯酸(PAA)接枝过程将微金器件的布局图案化到 PDMS 表面上。接枝 PAA 上的羧酸基团充当了一系列湿化学反应的支架,导致金纳米粒子在紫外光暴露区域的固定,随后在纳米粒子的催化作用下发生无电沉积。采用这种方法制备的金器件可以耐受 Scotch 胶带测试,并在反复弯曲-拉直测试中存活。它们在酸性和碱性溶液中也表现出良好的稳定性,具有与标准金盘电极几乎相同的电化学性能,并允许巯基化合物在其表面形成完美的自组装单层。所制备的微金电极适合作为全 PDMS 微电泳芯片中的集成安培检测元件。

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